电子元件封装术语大全目录1、BGA(ballgridarray).............................................................................................................32、BQFP(quadflatpackagewithbumper)...............................................................................33、碰焊PGA(buttjointpingridarray)表面贴装型PGA的别称(见表面贴装型PGA)。...34、C-(ceramic)..........................................................................................................................35、Cerdip..................................................................................................................................36、Cerquad...............................................................................................................................47、CLCC(ceramicleadedchipcarrier)......................................................................................48、COB(chiponboard).............................................................................................................49、DFP(dualflatpackage)........................................................................................................410、DIC(dualin-lineceramicpackage).....................................................................................411、DIL(dualin-line).................................................................................................................512、DIP(dualin-linepackage)...................................................................................................513、DSO(dualsmallout-lint)....................................................................................................514、DICP(dualtapecarrierpackage)........................................................................................515、DIP(dualtapecarrierpackage)..........................................................................................516、FP(flatpackage)..............................................................................................
