基于6UVPX主板的铝基均热板散热性能实验研究*李翊(海军装备部驻西安地区军事代表局,陕西西安710054)摘要:针对某6UVPX高性能主板发热器件众多、总热功耗大导致的散热难题,开展了铝基均热板散热盒的工程应用实验研究。测试结果表明:常温28℃环境中,自然散热工况下铝基均热板散热盒无法满足主板散热要求,风冷散热工况下,铝基均热板散热盒上最大温差为7.2℃,CPU和DSP芯片最大结温分别为45℃和50℃;高温60℃环境中,均热板上最大温差为6.7℃,CPU和DSP芯片最大结温分别为85℃和83℃,低于允许结温105℃。由此可知,铝基均热板散热盒散热性能显著,配合风冷工况可以满足标准6UVPX高性能大功耗主板的散热需求,是解决主板散热困难的有效手段。关键词:VPX主板;均热板;散热性能;实验研究中图分类号:TK124文献标志码:Adoi:10.3969/j.issn.1007-130X.2023.06.005Experimentalresearchonheatdissipationperformanceofaluminousvaporchamberbasedon6UVPXmotherboardLIYi(NavalEquipmentDepartmentMilitaryRepresentativeOfficeinXi’anRegion,Xi’an710054,China)Abstract:Aimingattheheatdissipationproblemofa6UVPXhigh-performancemotherboardwithmanyheatingdevicesandlargetotalthermalpowerconsumption,Anengineeringapplicationexperimen-talresearchonthealuminousvaporchamberiscarriedout.Thetestresultsshowthatthealuminousva-porchambercannotmeettheheatdissipationrequirementsofthemotherboardundernaturalheatdissi-pationconditionsatthenormaltemperatureof28℃,themaximumtemperaturedifferenceonthealu-minousvaporchamberis7.2℃undertheair-cooledheatdissipationcondition,andthemaximumjunc-tiontemperatureoftheCPUandDSPchipsis45℃and50℃respectively.Themaximumtemperaturedifferenceonthealuminousvaporchamberis6.7℃ata60℃-hightemperatureenvironment,andthemaximumjunctiontemperatureoftheCPUandDSPchipsis85℃and83℃respectively,whichislow-erthantheallowablejunctiontemperatureof105℃.Itisconcludedthattheheatdissipationperform-anceofthealuminousvaporchamberisremarkable,anditcanmeettheheatdissipationrequirementsofthestandard6UVPXhigh-performanceandhigh-powerconsumptionmotherboardwithair-coolingcon-ditions,whichisoneoftheeffectivemethodstosolvetheheatdissipationdifficultyofthemotherboard.Keywor...
