IEC_TR_61189-5-506-2019.pdf

IEC TR 61189-5-506 Edition 1.0 2019-06 TECHNICAL REPORT Test methods for electrical materials,printed boards and other interconnection structures and assemblies Part 5-506:General test methods for materials and assemblies An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance(SIR)testing of solder fluxes in accordance with IEC 61189-5-501 IEC TR 61189-5-506:2019-06(en)colourinside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2019 IEC,Geneva,Switzerland All rights reserved.Unless otherwise specified,no part of this publication may be reproduced or utilized in any form or by any means,electronic or mechanical,including photocopying and microfilm,without permission in writing from either IEC or IECs member National Committee in the country of the requester.If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,please contact the address below or your local IEC member National Committee for further information.IEC Central Office Tel.:+41 22 919 02 11 3,rue de Varemb infoiec.ch CH-1211 Geneva 20 www.iec.ch Switzerland About the IEC The International Electrotechnical Commission(IEC)is the leading global organization that prepares and publishes International Standards for all electrical,electronic and related technologies.About IEC publications The technical content of IEC publications is kept under constant review by the IEC.Please make sure that you have the latest edition,a corrigendum or an amendment might have been published.IEC publications search-webstore.iec.ch/advsearchform The advanced search enables to find IEC publications by a variety of criteria(reference number,text,technical committee,).It also gives information on projects,replaced and withdrawn publications.IEC Just Published-webstore.iec.ch/justpublished Stay up to date on all new IEC publications.Just Published details all new publications released.Available online and once a month by email.IEC Customer Service Centre-webstore.iec.ch/csc If you wish to give us your feedback on this publication or need further assistance,please contact the Customer Service Centre:salesiec.ch.Electropedia-www.electropedia.org The worlds leading online dictionary on electrotechnology,containing more than 22 000 terminological entries in English and French,with equivalent terms in 16 additional languages.Also known as the International Electrotechnical Vocabulary(IEV)online.IEC Glossary-std.iec.ch/glossary 67 000 electrotechnical terminology entries in English and French extracted from the Terms and Definitions clause of IEC publications issued since 2002.Some entries have been collected from earlier publications of IEC TC 37,77,86 and CISPR.IEC TR 61189-5-506 Edition 1.0 2019-06 TECHNICAL REPORT Test methods for electrical materials,printed boards and other interconnection structures and assemblies Part 5-506:General test methods for materials and assemblies An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance(SIR)testing of solder fluxes in accordance with IEC 61189-5-501 INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 31.180 ISBN 978-2-8322-7083-7 Registered trademark of the International Electrotechnical Commission Warning!Make sure that you obtained this publication from an authorized distributor.colourinside 2 IEC TR 61189-5-506:2019 IEC 2019 CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope.7 2 Normative references.7 3 Terms and definitions.7 4 Test board concept for intercomparison.7 4.1 The need for a fine-pitch SIR pattern.7 4.2 Test board design.8 4.3 Test board fluxing.9 5 Test procedure for intercomparison.10 5.1 Sample preparation.10 5.2 Preparation of samples for humidity chamber.11 5.3 Placement of samples inside the humidity chamber.11 5.4 Resistance measurements.12 5.5 Evaluation of results.12 5.6 Additional information.12 6 Results.12 Bibliography.23 Figure 1 TB144.9 Figure 2 Connector arrangement.11 Figure 3 Sample orientation in test chamber.12 Figure 4 Participants(a to f)resistance measurements for the six test patterns on the checker board.13 Figure 5 Participant A control boards.13 Figure 6 Participant A flux loaded boards.14 Figure 7 Participant B control boards.14 Figure 8 Participant B flux loaded boards.14 Figure 9 Participant C control boards.15 Figure 10 Participant C flux loaded boards.15 Figure 11 Participant D control boards.15 Figure 12 Participant D flux loaded boards.16 Figure 13 Participant E control boards.16 Figure 14 Participant E flux loaded boards.16 Figure 15 Participant F control boards.17 Figure 16 Participant F flux loaded boards.17 Figure 17 Participant G control boards.17 Figure 18 Participant G flux loaded boards.18 Figure 19 Participant D,and evidence of a fibre and the effect on the SIR.18 Figure 20 Participant E and evidence or corrosion shorting across the gap.18 Figure 21 Participant G and evidence of a water droplet and the result