IEC_PAS_62169-2000.pdf

Standard for handling,packing,shipping and use of moisture/reflowsensitive surface mount devices3 8%/,&/?$9$,/$%/(?6 3(&,),&$7,2 1,(&?3$6?Edition 1.02000-08I N T E R N A T I O N A LE L E C T R O T E C H N I C A LC O M M I S S I O NReference number IEC/PAS 62169LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.JOINTINDUSTRYSTANDARDStandard for Handling,Packing,Shipping andUse of Moisture/ReflowSensitive SurfaceMount DevicesIPC/JEDEC J-STD-033MAY 1999LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.Copyright 1999,JEDEC;2000,IECPage i INTERNATIONAL ELECTROTECHNICAL COMMISSION_STANDARD FOR HANDLING,PACKING,SHIPPING AND USEOF MOISTURE/REFLOW SENSITIVE SURFACE MOUNT DEVICESFOREWORDA PAS is a technical specification not fulfilling the requirements for a standard,but made available to thepublic and established in an organization operating under given procedures.IEC-PAS 62169 was submitted by JEDEC and has been processed by IEC technical committee 47:Semiconductordevices.The text of this PAS is based on thefollowing document:This PAS was approved forpublication by the P-members of thecommittee concerned as indicated inthe following document:Draft PASReport on voting47/1469/PAS47/1502/RVDFollowing publication of this PAS,the technical committee or subcommittee concerned will investigate thepossibility of transforming the PAS into an International Standard.An IEC-PAS licence of copyright and assignment of copyright has been signed by the IEC and JEDEC and isrecorded at the Central Office.1)The IEC(International Electrotechnical Commission)is a worldwide organization for standardization comprising allnational electrotechnical committees(IEC National Committees).The object of the IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields.To this end and in additionto other activities,the IEC publishes International Standards.Their preparation is entrusted to technical committees;any IEC National Committee interested in the subject dealt with may participate in this preparatory work.International,governmental and non-governmental organizations liaising with the IEC also participate in this preparation.The IECcollaborates closely with the International Organization for Standardization(ISO)in accordance with conditionsdetermined by agreement between the two organizations.2)The formal decisions or agreements of the IEC on technical matters express,as nearly as possible,an internationalconsensus of opinion on the relevant subjects since each technical committee has representation from all interestedNational Committees.3)The documents produced have the form of recommendations for international use and are published in the form ofstandards,technical specifications,technical reports or guides and they are accepted by the National Committees inthat sense.4)In order to promote international unification,IEC National Committees undertake to apply IEC International Standardstransparently to the maximum extent possible in their national and regional standards.Any divergence between theIEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter.5)The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for anyequipment declared to be in conformity with one of its standards.6)Attention is drawn to the possibility that some of the elements of this PAS may be the subject of patent rights.TheIEC shall not be held responsible for identifying any or all such patent rights.LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.Joint IPC/JEDEC Standard J-STD-033-i-STANDARD FOR HANDLING,PACKING,SHIPPING AND USE OF MOISTURE/REFLOWSENSITIVE SURFACE MOUNT DEVICESContentsPage1 Foreword12 Purpose13 Scope13.1 Packages13.2 Assembly process23.3 Reliability24 Applicable documents24.1 EIA JEDEC/Institute for Interconnecting and Packaging Electronic Circuits(IPC)&Joint Industry Standards24.2 Electronic Industries Alliance(EIA,JEDEC)24.3 Department of Defense34.4 American Society for testing and Materials(ASTM)35 Terms and definitions36 Dry packing46.1 Requirements46.2 Drying of components before being sealed in MBBs46.3 Dry pack57 Drying87.1 Post exposure to factory ambient97.2 General considerations for baking98 Use108.1 Incoming bag inspection108.2 Floor life118.3 Safe storage118.4 Reflow118.5 Drying indicators128.6 Board rework139 Derating due to factory environmental conditions13Cop