IEC_PAS_62326-14-2010.pdf

IEC/PAS 62326-14Edition 1.0 2010-09PUBLICLY AVAILABLE SPECIFICATIONPRE-STANDARD Printed boards Part 14:Device embedded substrate Terminology/reliability/design guide IEC/PAS 62326-14:2010(E)colourinsideCopyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,,downloaded on Nov-28-2014 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2010 IEC,Geneva,Switzerland All rights reserved.Unless otherwise specified,no part of this publication may be reproduced or utilized in any form or by any means,electronic or mechanical,including photocopying and microfilm,without permission in writing from either IEC or IECs member National Committee in the country of the requester.If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,please contact the address below or your local IEC member National Committee for further information.IEC Central Office 3,rue de Varemb CH-1211 Geneva 20 Switzerland Email:inmailiec.ch Web:www.iec.ch About the IEC The International Electrotechnical Commission(IEC)is the leading global organization that prepares and publishes International Standards for all electrical,electronic and related technologies.About IEC publications The technical content of IEC publications is kept under constant review by the IEC.Please make sure that you have the latest edition,a corrigenda or an amendment might have been published.?Catalogue of IEC publications:www.iec.ch/searchpub The IEC on-line Catalogue enables you to search by a variety of criteria(reference number,text,technical committee,).It also gives information on projects,withdrawn and replaced publications.?IEC Just Published:www.iec.ch/online_news/justpub Stay up to date on all new IEC publications.Just Published details twice a month all new publications released.Available on-line and also by email.?Electropedia:www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions in English and French,with equivalent terms in additional languages.Also known as the International Electrotechnical Vocabulary online.?Customer Service Centre:www.iec.ch/webstore/custserv If you wish to give us your feedback on this publication or need further assistance,please visit the Customer Service Centre FAQ or contact us:Email:csciec.ch Tel.:+41 22 919 02 11 Fax:+41 22 919 03 00 Copyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,,downloaded on Nov-28-2014 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.IEC/PAS 62326-14Edition 1.0 2010-09PUBLICLY AVAILABLE SPECIFICATIONPRE-STANDARD Printed boards Part 14:Device embedded substrate Terminology/reliability/design guide INTERNATIONAL ELECTROTECHNICAL COMMISSION XBICS 31.180 PRICE CODEISBN 978-2-88912-180-9 Registered trademark of the International Electrotechnical Commission colourinsideCopyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,,downloaded on Nov-28-2014 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.2 PAS 62326-14 IEC:2010(E)CONTENTS FOREWORD.6 1 Scope.8 2 Normative references.8 3 General definitions.9 3.1 Technology of the device embedded substrate.9 3.2 Substrate.12 3.3 Jisso mounting and interconnection.13 3.4 Structure and terminology.15 3.4.1 General.15 3.4.2 Device embedding by conventional process.17 3.4.3 Electrical connection by vias after device embedding.19 3.4.4 Embedding of various devices over multiple layers.20 4 Test methods.22 4.1 General.22 4.2 Structure of TEG(Test Equipment Group Test vehicle).22 4.3 Test circuit.24 4.4 Test specimen(TEG)and example of test substrate.26 5 Test items and test equipment.27 5.1 General.27 5.2 Test for resistance of conductor.28 5.3 Resistance to over current.29 5.4 Withstand voltage.30 5.5 Insulation resistance.30 5.6 Peeling strength of conductor.32 5.7 Pull-off strength of plated through hole.32 5.8 Adhesivity of plated film.32 5.9 Solderability.33 5.10 Thermal shock(vapour phase cold heat cycle).34 5.11 Thermal shock(high temperature).35 5.12 Flammability.36 5.13 Bow and twist.36 5.14 Migration.37 6 Indication,packaging and storage.37 7 Design guide.38 7.1 General.38 7.2 Structure of device embedded substrate.38 7.2.1 General.38 7.2.2 Specification of the front and back surfaces of a device embedded substrate.38 7.2.3 Definition of layers of a device embedded substrate.40 7.2.4 Definitions of insulation layer thickness,conductor spacing and distance between electrode and conductor spacing(hereafter called“electrode”)at a terminal.44 7.3 Conditions for base.47 7.4 Conditions for embedding devices.48 Copyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,,downloaded on Nov-28-2014 by James Madison.No further reproduction or distribution is perm