IEC_63003-2015.pdf

IEC 63003 Edit ion 1.0 2015-12 INTER NA TIONA L STA NDA R D St andard for t he common test int erface pin map configuration for high-density,single-tier elect ronics test requirement s utilizing IEEE St d 1505 IEC 63003:2015-12(en)IEEE St d 1505.1-2008 IEEE Std 1505.1 colourinsideAuthorized licensed use limited to:University of Waterloo.Downloaded on April 08,2016 at 00:47:07 UTC from IEEE Xplore.Restrictions apply.THIS PUBLICA TION IS COPYRIGHT PROTECTED Copyright 2008 IEEE All rights reserved.IEEE is a registered tr ademar k in the U.S.Patent&Trademar k Off ice,owned by the Institute of Electrical and Electronics Engineer s,Inc.Unless otherwise specified,no par t of this publication may be repr oduced or utilized in any for m or by any means,electronic or mechanical,including photocopying and microfilm,without per mission in writing from the IEC Central Office.Any questions about IEEE copyright should be addressed to the IEEE.Enquiries about obtaining additional rights to this publication and other infor mation r equests should be addressed to the IEC or your local IEC member National Committee.IEC Centr al Office Institute of Electrical and Electronics Engineer s,Inc.3,rue de Varemb 3 Par k Avenue CH-1211 Geneva 20 New Yor k,NY 10016-5997 Switzerland United States of America Tel.:+41 22 919 02 11 stds.infoieee.org Fax:+41 22 919 03 00 www.ieee.org inf oiec.ch www.iec.ch About t he IEC The International Electr otechnical Commission(IEC)is the leading global organization that prepar es and publishes Inter national Standards for all electr ical,electronic and related technologies.A bout IEC publications The technical content of IEC publications is kept under constant review by the IEC.Please make sur e that you have the latest edition,a cor rigenda or an amendment might have been published.IEC Cat alogue-webst ore.iec.c h/cat alogue The stand-alone application for consulting the entire bibliographical information on IEC International Standards,Technical Specifications,Technical R eports and other documents.Av ailable for PC,Mac OS,Android Tablets and iPad.IEC publicat ions search-ww w.iec.ch/searchpub The adv anced search enables to find IEC publications by a v ariety of criteria(reference number,text,technical committee,).It also giv es information on projec ts,replaced and withdrawn publications.IEC Just Published-w ebst ore.iec.ch/just published Stay up to date on all new IEC publications.Just Published details all new publications released.Av ailable online and also once a month by email.Elect ropedia-ww w.elect ropedia.org The worlds leading online dic tionary of elec tronic and electrical terms containing more than 30 000 terms and definitions in English and French,with equiv alent terms in 15 additional languages.Also known as the International Electrotechnical Vocabulary(IEV)online.IEC Glossar y-st d.iec.ch/glossar y More than 60 000 electrotechnical terminology entries in English and French extracted from the Terms and Definitions clause of IEC publications issued since 2002.Some entries have been collected from earlier publications of IEC TC 37,77,86 and CISPR.IEC Cust omer Service Cent re-webst ore.iec.ch/csc If you wish to giv e us your feedback on this publication or need further assistance,please contact the Customer Serv ice Centre:csciec.ch.Authorized licensed use limited to:University of Waterloo.Downloaded on April 08,2016 at 00:47:07 UTC from IEEE Xplore.Restrictions apply.IEC 63003 Edit ion 1.0 2015-12 INTER NA TIONA L STA NDA R D Standard for the common test interface pin map configuration for high-density,single-tier electronics test requirements utilizing IEEE Std 1505 INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 25.040 IEC ISBN:978-2-8322-2941-5 IEEE ISBN:978-1-5044-0580-5STD20742 W arning!Make sur e that y ou obtained this publication from an author ized distributor.IEEE Std 1505.1 Register ed tr ademar k of the Inter national Electr otechnical Commission colourinsideAuthorized licensed use limited to:University of Waterloo.Downloaded on April 08,2016 at 00:47:07 UTC from IEEE Xplore.Restrictions apply.v ii Contents 1.Ov er v iew.1 1.1 Scope.1 1.2 Pu rpose.2 1.3 St a t ement of t he pr oblem.2 2.Norma t iv e references.3 3.Definitions,a cron yms,a n d a bbrev ia tions.4 3.1 Definit ion s.4 3.2 Specifica t ion t erms.4 3.3 Acr on yms and a bbrev ia t ions.4 4.Com mon t est int er fa ce r equ irement s.8 4.1 Int rod u ct ion.8 4.2 CTI open syst em r eq uir ement s.8 4.3 CTI cost req u irement s.9 4.4 Ver t ica l int egra tion t est su pport req u irements.9 4.5 CTI configu r a t ion/int eropera bility r equ ir ements.10 4.6 Ma int a ina bility/end-u ser su ppor t requ ir ement s.10 4.7 Sca lea ble a r chit ect u re r equ ir ements.10 4.8 Physica l fr amework r equ ir ement s.12 4.9 Relia bility req uir ements.17 4.10 CTI connect or foot pr int/pa ra met r ic r equ ir ement s.18 4.11 CTI pin ma p r equ ir ements.22 4.12 CTI pin ma p inpu t/ou t pu t configu ra t ion .33 An nex A(norm