IEC_TR_61191-7-2020.pdf

IEC TR 61191-7 Edition 1.0 2020-03 TECHNICAL REPORT Printed board assemblies Part 7:Technical cleanliness of components and printed board assemblies IEC TR 61191-7:2020-03(en)colourinside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2020 IEC,Geneva,Switzerland All rights reserved.Unless otherwise specified,no part of this publication may be reproduced or utilized in any form or by any means,electronic or mechanical,including photocopying and microfilm,without permission in writing from either IEC or IECs member National Committee in the country of the requester.If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,please contact the address below or your local IEC member National Committee for further information.IEC Central Office Tel.:+41 22 919 02 11 3,rue de Varemb infoiec.ch CH-1211 Geneva 20 www.iec.ch Switzerland About the IEC The International Electrotechnical Commission(IEC)is the leading global organization that prepares and publishes International Standards for all electrical,electronic and related technologies.About IEC publications The technical content of IEC publications is kept under constant review by the IEC.Please make sure that you have the latest edition,a corrigendum or an amendment might have been published.IEC publications search-webstore.iec.ch/advsearchform The advanced search enables to find IEC publications by a variety of criteria(reference number,text,technical committee,).It also gives information on projects,replaced and withdrawn publications.IEC Just Published-webstore.iec.ch/justpublished Stay up to date on all new IEC publications.Just Published details all new publications released.Available online and once a month by email.IEC Customer Service Centre-webstore.iec.ch/csc If you wish to give us your feedback on this publication or need further assistance,please contact the Customer Service Centre:salesiec.ch.Electropedia-www.electropedia.org The worlds leading online dictionary on electrotechnology,containing more than 22 000 terminological entries in English and French,with equivalent terms in 16 additional languages.Also known as the International Electrotechnical Vocabulary(IEV)online.IEC Glossary-std.iec.ch/glossary 67 000 electrotechnical terminology entries in English and French extracted from the Terms and Definitions clause of IEC publications issued since 2002.Some entries have been collected from earlier publications of IEC TC 37,77,86 and CISPR.IEC TR 61191-7 Edition 1.0 2020-03 TECHNICAL REPORT Printed board assemblies Part 7:Technical cleanliness of components and printed board assemblies INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 31.180;31.190 ISBN 978-2-8322-7901-4 Registered trademark of the International Electrotechnical Commission Warning!Make sure that you obtained this publication from an authorized distributor.colourinside 2 IEC TR 61191-7:2020 IEC 2020 CONTENTS FOREWORD.8 INTRODUCTION.10 1 Scope.11 2 Normative references.11 3 Terms and definitions.11 4 Technical cleanliness.11 4.1 What is technical cleanliness?.11 4.2 History standardisation of technical cleanliness.12 4.3 Technical cleanliness in the electronics industry.12 4.4 Potential particle-related malfunctions.12 5 Technical cleanliness as a challenge for the supply chain.13 5.1 General.13 5.2 Contamination.14 5.2.1 Definition of particles.14 5.2.2 Definition of fibres.14 5.3 Test procedure to determine technical cleanliness.15 5.3.1 Fundamentals.15 5.3.2 Clarification form.16 5.3.3 System technology.18 5.3.4 Process parameters for pressure rinsing extraction.19 5.3.5 Pressure rinsing process.19 5.3.6 Preparing membrane filters for measurement analysis.20 5.4 Measurement analysis.22 5.5 Evaluating the results of cleanliness analyses.22 5.5.1 Overview.22 5.5.2 Particle count relative to component surface.23 5.5.3 Procedure for violation of action control limits.24 5.6 Extended risk assessment.25 5.6.1 General.25 5.6.2 Example.25 5.7 Component cleanliness Data management and visualization.27 5.7.1 Component cleanliness analysis flow diagram.27 5.7.2 Explanation of SCI(Surface Cleanliness Index).28 5.7.3 Creating a database.31 5.7.4 Summary.34 6 State of the art Technical cleanliness in the electronics industry.35 6.1 Process flow(per cluster).35 6.1.1 General.35 6.1.2 Electronics manufacturing cluster.35 6.1.3 Passive components cluster(e.g.for inductors and aluminium electrolytic capacitors).36 6.1.4 Electromechanical components cluster.37 6.1.5 PCB cluster.39 6.2 Technical cleanliness in the electronics industry current situation.39 6.2.1 General.39 6.2.2 Electronics manufacturing.40 IEC TR 61191-7:2020 IEC 2020 3 6.2.3 Electronic components.41 6.2.4 Electromechanical components.44 6.2.5 Metal housings.48 6.2.6 Packaging.49 6.2.7 Printed circuit boards(PCBs).49 6.3 Determining potential particle sources in production areas.52 6.3.1 General.52 6.3.2 Particle generation.52 6.3.3 Electronics manufacturing cluster.52 6.3.4