IEC_PAS_62326-7-1-2007.pdf

PUBLICLY AVAILABLE SPECIFICATION IEC PAS 62326-7-1 First edition2007-04 Performance guide for single-and double-sided flexible printed wiring boards Reference number IEC/PAS 62326-7-1:2007(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC,Geneva,Switzerland All rights reserved.Unless otherwise specified,no part of this publication may be reproduced or utilized in any form or by any means,electronic or mechanical,including photocopying and microfilm,without permission in writing from either IEC or IECs member National Committee in the country of the requester.If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,please contact the address below or your local IEC member National Committee for further information.IEC Central Office 3,rue de Varemb CH-1211 Geneva 20 Switzerland Email:inmailiec.ch Web:www.iec.ch About the IEC The International Electrotechnical Commission(IEC)is the leading global organization that prepares and publishes International Standards for all electrical,electronic and related technologies.About IEC publications The technical content of IEC publications is kept under constant review by the IEC.Please make sure that you have the latest edition,a corrigenda or an amendment might have been published.?Catalogue of IEC publications:www.iec.ch/searchpub The IEC on-line Catalogue enables you to search by a variety of criteria(reference number,text,technical committee,).It also gives information on projects,withdrawn and replaced publications.?IEC Just Published:www.iec.ch/online_news/justpub Stay up to date on all new IEC publications.Just Published details twice a month all new publications released.Available on-line and also by email.?Customer Service Centre:www.iec.ch/webstore/custserv If you wish to give us your feedback on this publication or need further assistance,please visit the Customer Service Centre FAQ or contact us:Email:csciec.ch Tel.:+41 22 919 02 11 Fax:+41 22 919 03 00 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.PUBLICLY AVAILABLE SPECIFICATIONIEC PAS 62326-7-1 First edition2007-04 Performance guide for single-and double-sided flexible printed wiring boards PRICE CODE X For price,see current catalogue Commission Electrotechnique InternationaleInternational Electrotechnical Commission LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 PAS 62326-7-1 IEC:2007(E)CONTENTS FOREWORD.5 1 Scope.6 2 Normative references.6 3 Terms and definitions.6 4 Test methods.6 5 Performance levels.7 6 Base materials.7 7 Visual inspection.7 7.1 Test environment.7 7.2 Test specimens.7 7.3 Tools for testing.7 7.4 Preparation of limit samples.7 7.5 Description of inspection.7 8 Dimensional inspections.23 8.1 Measurement of dimension.23 8.2 External dimension.23 8.3 Thickness.24 8.4 Hole diameter.24 8.5 Conductor width.24 8.6 Cumulative pattern pitch.24 8.7 Distance between hole centers.25 8.8 Design minimum distance between board edge and conductor.26 8.9 Position accuracy.26 8.10 Registration of pressure sensitive or heatactivated adhesive(Including adhesive squeeze-out)to flexible printed board and stiffener.28 9 Electrical performance test.29 10 Mechanical performance test.30 11 Environmental performance.31 12 Chemical resistance.31 13 Cleanliness.31 14 Flame resistance.31 15 Marking,packaging,and storage.31 15.1 Marking on products.32 15.2 Marking on package.32 15.3 Packaging and storage.32 Annex A Handling instruction manual handling of polyimide-base FPC.33 Annex B Ion migration test.35 Annex C Whisker test.36 Annex D Additional information Explanation on JPCA performance guide for single-and double-sided flexible printed wiring boards.38 Figure 1 Nicks and pinholes in conductor.8 Figure 2 Reduced area on land.8 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.PAS 62326-7-1 IEC:2007(E)3 Figure 3 Circumferential void at the component hole.8 Figure 4 Unnecessary copper between conductor/spur and nodule of conductor.9 Figure 5 Unnecessary copper,spurs and nodules in an open area and nodules of conductor corners.9 Figure 6 Etched concave surface of the conductor and nodule at a conductor corner.10 Figure 7 Conductor delamination.10 Figure 8 Scratch on conductor.11 Figure 9 Voids.11 Figure 10 Foreign substance.12 Figure 11 Lifting and delamination of coverlay and covercoat.13 Figure 12 Allowable squeeze-out of coverlay adhesive and ooze-out of covercoat and photosensitive resist.13 Figure 13 Plating defects.14 Figure 14 Penetration of plated metal or solder.16 Figure 15 Plating voids in plated through hole.17 Figure 16 Tear and nick.17 Figure 17 Burrs.17 Figure 18 Thready burrs.18 Figure 19 Foreign substance between board