IEC_TR_61760-3-1-2022.pdf

IEC TR 61760-3-1 Edition 1.0 2022-06 TECHNICAL REPORT Surface mounting technology Part 3-1:Standard method for the specification of components for through hole reflow(THR)soldering Guidelines for through hole diameter design with solder paste surface printing method IEC TR 61760-3-1:2022-06(en)colourinside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2022 IEC,Geneva,Switzerland All rights reserved.Unless otherwise specified,no part of this publication may be reproduced or utilized in any form or by any means,electronic or mechanical,including photocopying and microfilm,without permission in writing from either IEC or IECs member National Committee in the country of the requester.If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,please contact the address below or your local IEC member National Committee for further information.IEC Secretariat Tel.:+41 22 919 02 11 3,rue de Varemb infoiec.ch CH-1211 Geneva 20 www.iec.ch Switzerland About the IEC The International Electrotechnical Commission(IEC)is the leading global organization that prepares and publishes International Standards for all electrical,electronic and related technologies.About IEC publications The technical content of IEC publications is kept under constant review by the IEC.Please make sure that you have the latest edition,a corrigendum or an amendment might have been published.IEC publications search-webstore.iec.ch/advsearchform The advanced search enables to find IEC publications by a variety of criteria(reference number,text,technical committee,).It also gives information on projects,replaced and withdrawn publications.IEC Just Published-webstore.iec.ch/justpublished Stay up to date on all new IEC publications.Just Published details all new publications released.Available online and once a month by email.IEC Customer Service Centre-webstore.iec.ch/csc If you wish to give us your feedback on this publication or need further assistance,please contact the Customer Service Centre:salesiec.ch.IEC Products&Services Portal-products.iec.ch Discover our powerful search engine and read freely all the publications previews.With a subscription you will always have access to up to date content tailored to your needs.Electropedia-www.electropedia.org The worlds leading online dictionary on electrotechnology,containing more than 22 300 terminological entries in English and French,with equivalent terms in 19 additional languages.Also known as the International Electrotechnical Vocabulary(IEV)online.IEC TR 61760-3-1 Edition 1.0 2022-06 TECHNICAL REPORT Surface mounting technology Part 3-1:Standard method for the specification of components for through hole reflow(THR)soldering Guidelines for through hole diameter design with solder paste surface printing method INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 31.190 ISBN 978-2-8322-3928-5 Registered trademark of the International Electrotechnical Commission Warning!Make sure that you obtained this publication from an authorized distributor.colourinside 2 IEC TR 61760-3-1:2022 IEC 2022 CONTENTS FOREWORD.4 1 Scope.6 2 Normative references.6 3 Terms and definitions.6 4 Solder paste application methods.6 4.1 General.6 4.2 Through hole filled method.8 4.2.1 Overview.8 4.2.2 Advantages.9 4.2.3 Disadvantages.9 4.3 Solder paste surface printing method.9 4.3.1 Overview.9 4.3.2 Advantages.9 4.3.3 Disadvantages.9 5 Solder paste printing stencil aperture design guidelines.10 5.1 General.10 5.2 Amount of solder paste.10 5.2.1 Needed amount of solder paste.10 5.2.2 Printing volume of solder paste.11 5.2.3 Designing amount of printing solder paste.13 6 Influence of terminal position tolerance on through hole diameter and stencil aperture design guidelines.13 6.1 Terminal position tolerance.13 6.2 Relationship between terminal position tolerance and through hole diameter.14 6.2.1 General.14 6.2.2 Terminal position tolerance of 0,40 mm.14 6.2.3 Terminal position tolerance of 0,30 mm.15 6.2.4 Terminal position tolerance of 0,20 mm.15 6.3 Circuit board though hole diameter design guidelines for THR components.16 6.3.1 Circuit board though hole diameter design.16 6.3.2 Relationship through hole diameter and solder paste supply.17 Annex A(informative)Calculation method for solder fillet volume of the round terminal.21 Annex B(informative)Calculation method for metal volume of the printed solder paste.24 Bibliography.26 Figure 1 Solder paste application method.7 Figure 2 Through hole filled method(bottom side view).8 Figure 3 Solder paste fallen inside the reflow oven(through hole filled method).8 Figure 4 Solder paste state of solder paste surface printing method.8 Figure 5 Conceptual view of solder wetting of component terminals after reflow soldering.10 Figure 6 Single area printing.12 Figure 7 Slit printing.13 Figure 8 Terminal position tolerance 0,40 mm,through hole diameter 1,40 mm(one side clearance 0,20 mm).14 IEC TR 61760-3-1:2022 IEC 2022 3 Figure