IEC_PAS_61249-3-1-2007.pdf

PUBLICLY AVAILABLE SPECIFICATION IEC PAS 61249-3-1Pre-Standard First edition2007-05 Materials for printed boards and other interconnecting structures Part 3-1:Copper-clad laminates for flexible boards(adhesive and non-adhesive types)Reference number IEC/PAS 61249-3-1:2007(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC,Geneva,Switzerland All rights reserved.Unless otherwise specified,no part of this publication may be reproduced or utilized in any form or by any means,electronic or mechanical,including photocopying and microfilm,without permission in writing from either IEC or IECs member National Committee in the country of the requester.If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,please contact the address below or your local IEC member National Committee for further information.IEC Central Office 3,rue de Varemb CH-1211 Geneva 20 Switzerland Email:inmailiec.ch Web:www.iec.ch About the IEC The International Electrotechnical Commission(IEC)is the leading global organization that prepares and publishes International Standards for all electrical,electronic and related technologies.About IEC publications The technical content of IEC publications is kept under constant review by the IEC.Please make sure that you have the latest edition,a corrigenda or an amendment might have been published.?Catalogue of IEC publications:www.iec.ch/searchpub The IEC on-line Catalogue enables you to search by a variety of criteria(reference number,text,technical committee,).It also gives information on projects,withdrawn and replaced publications.?IEC Just Published:www.iec.ch/online_news/justpub Stay up to date on all new IEC publications.Just Published details twice a month all new publications released.Available on-line and also by email.?Customer Service Centre:www.iec.ch/webstore/custserv If you wish to give us your feedback on this publication or need further assistance,please visit the Customer Service Centre FAQ or contact us:Email:csciec.ch Tel.:+41 22 919 02 11 Fax:+41 22 919 03 00 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.PUBLICLY AVAILABLE SPECIFICATIONIEC PAS 61249-3-1Pre-Standard First edition2007-05 Materials for printed boards and other interconnecting structures Part 3-1:Copper-clad laminates for flexible boards(adhesive and non-adhesive types)PRICE CODE V For price,see current catalogueCommission Electrotechnique InternationaleInternational Electrotechnical Commission LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 PAS 61249-3-1 IEC:2007(E)CONTENTS FOREWORD.4 1 Scope.6 2 Normative references.6 3 Terms and definitions.6 4 Designation of copper-clad laminates.6 4.1 Copper-clad laminate.7 4.2 Base materials.7 4.3 Thickness of the base material.7 4.4 Types of adhesives.8 4.5 Thickness of base materials and adhesives.8 4.6 Type of copper foil.9 4.7 Grade of copper foil.9 4.8 Copper-foil thickness.9 4.9 Types of profiles.10 4.10 Surface treatment to increase copper adhesivity and anti-rust.10 4.11 Symbol for flammability.10 5 Observation.10 5.1 Base film.10 5.2 Copper foil.11 5.3 CCL.11 6 Size.12 6.1 Base film.12 6.1.1 Thickness and its allowance.12 6.2 Copper foil.12 6.2.1 Thickness and its allowance.12 6.3 Adhesives.13 6.3.1 Adhesives.13 6.4 Copper-clad laminates.13 6.4.1 Thickness and its allowance.13 6.4.2 Sheet dimension and its allowance.13 6.4.3 Role dimension and its allowance.13 7 Properties.13 7.1 Base film.13 7.2 Copper foil.15 7.3 CCL.17 8 Package and labelling.25 Annex A(normative)Roughness test.26 Annex B(normative)Dimensional stability test.27 Appendix.30 Figure B.1 Test pattern for the dimensional stability test.27 Table 1 Copper-clad laminates.7 Table 2 Base materials.7 Table 3 Thickness of base material.8 Table 4 Adhesives.8 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.PAS 61249-3-1 IEC:2007(E)3 Table 5 Thickness of adhesives.9 Table 6 Grade of copper foil.9 Table 7 Thickness of copper foil(Types E and R).10 Table 8 Types of profiles.10 Table 9 Appearance of CCL.11 Table 10 Thickness and its allowance of base film.12 Table 11 Thickness and its allowance of copper foil(Types E and R).12 Table 12 Thickness and its allowance of adhesives.13 Table 13 Properties of polyimide film.14 Table 14 Properties of copper foil(type E).15 Table 15 Properties of copper foil(type R).16 Table 16 Properties of CCL Adhesive type(three layers)/polyimide film base.17 Table 17 Properties of CCL Non-adhesive type(two layers)/polyimide film base+copper foil(casting).19 Table 18 Properties of CCL Non-adhesive type(two layers)/polyimide film base+copper foil(sputter/plating).21 Table 19 Properties of CCL Non-adhesive type(two