IEC_TR_62258-3-2005.pdf

TECHNICAL REPORT IEC TR 62258-3 First edition2005-06 Semiconductor die products Part 3:Recommendations for good practice in handling,packing and storage Reference number IEC/TR 62258-3:2005(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.Publication numbering As from 1 January 1997 all IEC publications are issued with a designation in the 60000 series.For example,IEC 34-1 is now referred to as IEC 60034-1.Consolidated editions The IEC is now publishing consolidated versions of its publications.For example,edition numbers 1.0,1.1 and 1.2 refer,respectively,to the base publication,the base publication incorporating amendment 1 and the base publication incorporating amendments 1 and 2.Further information on IEC publications The technical content of IEC publications is kept under constant review by the IEC,thus ensuring that the content reflects current technology.Information relating to this publication,including its validity,is available in the IEC Catalogue of publications(see below)in addition to new editions,amendments and corrigenda.Information on the subjects under consideration and work in progress undertaken by the technical committee which has prepared this publication,as well as the list of publications issued,is also available from the following:IEC Web Site(www.iec.ch)Catalogue of IEC publications The on-line catalogue on the IEC web site(www.iec.ch/searchpub)enables you to search by a variety of criteria including text searches,technical committees and date of publication.On-line information is also available on recently issued publications,withdrawn and replaced publications,as well as corrigenda.IEC Just Published This summary of recently issued publications(www.iec.ch/online_news/justpub)is also available by email.Please contact the Customer Service Centre(see below)for further information.Customer Service Centre If you have any questions regarding this publication or need further assistance,please contact the Customer Service Centre:Email:custserviec.ch Tel:+41 22 919 02 11 Fax:+41 22 919 03 00 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.TECHNICAL REPORT IECTR 62258-3 First edition2005-06 Semiconductor die products Part 3:Recommendations for good practice in handling,packing and storage PRICE CODE IEC 2005 Copyright-all rights reserved No part of this publication may be reproduced or utilized in any form or by any means,electronic or mechanical,including photocopying and microfilm,without permission in writing from the publisher.International Electrotechnical Commission,3,rue de Varemb,PO Box 131,CH-1211 Geneva 20,SwitzerlandTelephone:+41 22 919 02 11 Telefax:+41 22 919 03 00 E-mail:inmailiec.ch Web:www.iec.ch X For price,see current catalogueCommission Electrotechnique InternationaleInternational Electrotechnical Commission LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 TR 62258-3 IEC:2005(E)CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope and object.7 2 Normative references.7 3 Terms and definitions.8 4 Handling Good practice.8 4.1 General.8 4.2 Working environmental controls.8 4.3 General handling precautions.8 4.4 Cleanroom good practice.8 5 Process handling issues.12 5.1 Wafer sawing.12 5.2 Die sorting.13 6 Die and wafer transport and storage media.16 6.1 Wafer carriers and cassettes.16 6.2 In-process carriers and transport systems.17 6.3 Packing for shipment of unsawn wafers.17 6.4 Packing for shipment of sawn wafers.18 6.5 Packing for shipment of single wafers.21 6.6 Packing for shipment of die using trays.21 6.7 Packing for shipment of die using tape-and-reel.25 6.8 Secondary packing for shipment.27 7 Storage good practice.28 7.1 Die and wafer storage.28 7.2 Short-term storage environment and conditions.28 7.3 Storage time limitations.28 7.4 Sawn wafer on wafer frame or ring.29 7.5 Die products in the production area.29 7.6 Die in tape-and-reel.29 7.7 Dry-packed die products.29 8 Traceability good practice.29 8.1 General.29 8.2 Wafer traceability.29 8.3 Die products traceability.29 8.4 Wafer and die back side marking.30 9 Guidelines for long-term storage(die banking)of bare die and wafers.30 9.1 General.30 9.2 Preparing for storage.30 9.3 Damage to die products during long-term storage.31 9.4 Long-term storage environment.31 9.5 Recommended inert atmosphere purity.32 9.6 Chemical contamination.32 9.7 Electrical effects.33 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.TR 62258-3 IEC:2005(E)3 9.8 Protection from radiation.33 9.9 Periodic qualification of stored die products.33 10 Good practice for automated handling during assembly.34 10.1 Removal of die from shipping media.34 10.2 Equipment out of service.34 Annex A(informative)Planning checklist.35 Annex B(informative)Material specifications.41 Bibliography.44 Figure 1 Bevel