IEc_TR_62658-2013.pdf

IEC/TR 62658 Edition 1.0 2013-07 TECHNICAL REPORT Roadmap of optical circuit boards and their related packaging technologies IEC/TR 62658:2013(E)colourinsideCopyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,,downloaded on Nov-27-2014 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2013 IEC,Geneva,Switzerland All rights reserved.Unless otherwise specified,no part of this publication may be reproduced or utilized in any form or by any means,electronic or mechanical,including photocopying and microfilm,without permission in writing from either IEC or IECs member National Committee in the country of the requester.If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,please contact the address below or your local IEC member National Committee for further information.IEC Central Office Tel.:+41 22 919 02 11 3,rue de Varemb Fax:+41 22 919 03 00 CH-1211 Geneva 20 infoiec.ch Switzerland www.iec.ch About the IEC The International Electrotechnical Commission(IEC)is the leading global organization that prepares and publishes International Standards for all electrical,electronic and related technologies.About IEC publications The technical content of IEC publications is kept under constant review by the IEC.Please make sure that you have the latest edition,a corrigenda or an amendment might have been published.Useful links:IEC publications search-www.iec.ch/searchpub The advanced search enables you to find IEC publications by a variety of criteria(reference number,text,technical committee,).It also gives information on projects,replaced and withdrawn publications.IEC Just Published-webstore.iec.ch/justpublished Stay up to date on all new IEC publications.Just Published details all new publications released.Available on-line and also once a month by email.Electropedia-www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 30 000 terms and definitions in English and French,with equivalent terms in additional languages.Also known as the International Electrotechnical Vocabulary(IEV)on-line.Customer Service Centre-webstore.iec.ch/csc If you wish to give us your feedback on this publication or need further assistance,please contact the Customer Service Centre:csciec.ch.Copyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,,downloaded on Nov-27-2014 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.IEC/TR 62658Edition 1.0 2013-07TECHNICAL REPORT Roadmap of optical circuit boards and their related packaging technologies INTERNATIONAL ELECTROTECHNICAL COMMISSION RICS 33.180.01;33.180.99 PRICE CODEISBN 978-2-8322-0915-8 Registered trademark of the International Electrotechnical Commission Warning!Make sure that you obtained this publication from an authorized distributor.colourinsideCopyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,,downloaded on Nov-27-2014 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.2 TR 62658 IEC:2013(E)CONTENTS FOREWORD.3 1 Scope.5 2 General.5 2.1 Background of optical packaging technology road map.5 2.2 Advantages of optical interconnects.7 2.3 Planar embedded optical waveguides.9 3 Standardization of board-level optical packaging.9 3.1 Role of IEC TC86/JWG9(with TC91).9 3.2 Optical circuit boards 20.10 3.3 Optical backplanes 22.11 3.4 Optical circuit board connectors 23.13 3.5 Opto-electronic modules on boards.14 3.6 Originating standards.15 4 Standardization road map.16 4.1 Performance trends for optical circuit boards.16 5 Standardization road map of optical circuit boards.17 Bibliography.18 Figure 1 Data transmission speed and capability trends for network traffic and server systems 2.6 Figure 2 Internet traffic and router power consumption in Japan 5.7 Figure 3 Increase of power consumption in future network.8 Figure 4 Comparison of power consumption of 10 Tbps electrical and optical routers.9 Figure 5 Discussion field in IEC TC86/JWG9(with TC91).10 Figure 6 Classification of optical circuit boards.11 Figure 7 Four types of optical backplane applications.13 Figure 8 Classification of optical circuit board connectors.14 Figure 9 Classification of optical modules on boards.15 Figure 10 De facto-standards in Japan 24.15 Figure 11 Performance trends for optical circuit boards.16 Figure 12 Standardization roadmap of optical circuit board and its related optical packaging.17 Copyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,,downloaded on Nov-27-2014 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.TR 62658 IEC:2013(E)3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ROADMAP OF OPTICAL CIRCUIT BOARDS AND THEIR RELATED PACKAGING TECHNOLOGIES FOREWORD