IEC_TS_62647-22-2013.pdf

IEC/TS 62647-22 Edition 1.0 2013-09 TECHNICAL SPECIFICATION Process management for avionics Aerospace and defence electronic systems containing lead-free solder Part 22:Technical guidelines IEC/TS 62647-22:2013(E)Copyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,,downloaded on Nov-27-2014 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2013 IEC,Geneva,Switzerland All rights reserved.Unless otherwise specified,no part of this publication may be reproduced or utilized in any form or by any means,electronic or mechanical,including photocopying and microfilm,without permission in writing from either IEC or IECs member National Committee in the country of the requester.If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,please contact the address below or your local IEC member National Committee for further information.IEC Central Office Tel.:+41 22 919 02 11 3,rue de Varemb Fax:+41 22 919 03 00 CH-1211 Geneva 20 infoiec.ch Switzerland www.iec.ch About the IEC The International Electrotechnical Commission(IEC)is the leading global organization that prepares and publishes International Standards for all electrical,electronic and related technologies.About IEC publications The technical content of IEC publications is kept under constant review by the IEC.Please make sure that you have the latest edition,a corrigenda or an amendment might have been published.Useful links:IEC publications search-www.iec.ch/searchpub The advanced search enables you to find IEC publications by a variety of criteria(reference number,text,technical committee,).It also gives information on projects,replaced and withdrawn publications.IEC Just Published-webstore.iec.ch/justpublished Stay up to date on all new IEC publications.Just Published details all new publications released.Available on-line and also once a month by email.Electropedia-www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 30 000 terms and definitions in English and French,with equivalent terms in additional languages.Also known as the International Electrotechnical Vocabulary(IEV)on-line.Customer Service Centre-webstore.iec.ch/csc If you wish to give us your feedback on this publication or need further assistance,please contact the Customer Service Centre:csciec.ch.Copyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,,downloaded on Nov-27-2014 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.IEC/TS 62647-22 Edition 1.0 2013-09 TECHNICAL SPECIFICATION Process management for avionics Aerospace and defence electronic systems containing lead-free solder Part 22:Technical guidelines INTERNATIONAL ELECTROTECHNICAL COMMISSION XB ICS 03.100.50;31.020;49.060 PRICE CODE ISBN 978-2-8322-1112-0 Registered trademark of the International Electrotechnical Commission Warning!Make sure that you obtained this publication from an authorized distributor.Copyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,,downloaded on Nov-27-2014 by James Madison.No further reproduction or distribution is permitted.Uncontrolled when printed.2 TS 62647-22 IEC:2013(E)CONTENTS FOREWORD.5 INTRODUCTION.7 1 Scope.9 2 Normative references.9 3 Terms,definitions and abbreviations.10 3.1 Terms and definitions.10 3.2 Abbreviations.15 4 Approach.16 4.1 General.16 4.2 Assumption.16 5 General Pb-free solder alloy behavior.17 5.1 General.17 5.2 Elevated temperature.17 5.3 Low temperatures.18 5.4 Temperature cycling.20 5.4.1 General.20 5.4.2 Solder thermal cycling failure mode.21 5.4.3 Stress relaxation considerations.21 5.4.4 Ramp rate.21 5.4.5 Dwell time at elevated temperature.21 5.4.6 Dwell time at low temperature.22 5.5 Rapid mechanical loading(vibration/shock).22 6 System level service environment.22 6.1 General.22 6.2 Service environment.23 6.3 Electronics/electrical equipment thermal environments.23 6.3.1 General.23 6.3.2 Electronics/electrical equipment steady temperatures.23 6.3.3 Electronics/electrical equipment temperature cycling.23 6.4 Vibration and shock.23 6.5 Humidity.24 6.6 Other environments:salt spray,fungus,cooling air quality,and fluid compatibility.24 6.7 Other special requirements.24 7 High performance electronics testing.24 8 Solder joint reliability considerations.25 8.1 General.25 8.1.1 Overview.25 8.1.2 Final solder joint composition.25 8.1.3 Solder wetting and final joint shape.25 8.1.4 Strength of the PCB/PWB and component interfaces.26 8.2 Mixing of solder alloys and finishes.26 8.3 Pb-free terminations in tin-lead joints.26 8.3.1 General.26 8.3.2 Ball grid array Pb-free terminations in tin-lead joints.27 Copyrighted material licensed to BR Demo by Thomson Reuters(Scientific),Inc.,,downloaded on Nov-27-2014 by James Madison.No further reproduction