IEC_61760-1-2006.pdf

INTERNATIONAL STANDARD IEC61760-1 Second edition2006-04 Surface mounting technology Part 1:Standard method for the specification of surface mounting components(SMDs)Reference number IEC 61760-1:2006(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.Publication numbering As from 1 January 1997 all IEC publications are issued with a designation in the 60000 series.For example,IEC 34-1 is now referred to as IEC 60034-1.Consolidated editions The IEC is now publishing consolidated versions of its publications.For example,edition numbers 1.0,1.1 and 1.2 refer,respectively,to the base publication,the base publication incorporating amendment 1 and the base publication incorporating amendments 1 and 2.Further information on IEC publications The technical content of IEC publications is kept under constant review by the IEC,thus ensuring that the content reflects current technology.Information relating to this publication,including its validity,is available in the IEC Catalogue of publications(see below)in addition to new editions,amendments and corrigenda.Information on the subjects under consideration and work in progress undertaken by the technical committee which has prepared this publication,as well as the list of publications issued,is also available from the following:IEC Web Site(www.iec.ch)Catalogue of IEC publications The on-line catalogue on the IEC web site(www.iec.ch/searchpub)enables you to search by a variety of criteria including text searches,technical committees and date of publication.On-line information is also available on recently issued publications,withdrawn and replaced publications,as well as corrigenda.IEC Just Published This summary of recently issued publications(www.iec.ch/online_news/justpub)is also available by email.Please contact the Customer Service Centre(see below)for further information.Customer Service Centre If you have any questions regarding this publication or need further assistance,please contact the Customer Service Centre:Email:custserviec.ch Tel:+41 22 919 02 11 Fax:+41 22 919 03 00 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.INTERNATIONAL STANDARD IEC61760-1 Second edition2006-04 Surface mounting technology Part 1:Standard method for the specification of surface mounting components(SMDs)IEC 2006 Copyright-all rights reserved No part of this publication may be reproduced or utilized in any form or by any means,electronic or mechanical,including photocopying and microfilm,without permission in writing from the publisher.International Electrotechnical Commission,3,rue de Varemb,PO Box 131,CH-1211 Geneva 20,SwitzerlandTelephone:+41 22 919 02 11 Telefax:+41 22 919 03 00 E-mail:inmailiec.ch Web:www.iec.ch U For price,see current cataloguePRICE CODE Commission Electrotechnique InternationaleInternational Electrotechnical Commission LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 61760-1 IEC:2006(E)CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope and object.7 1.1 Scope.7 1.2 Object.7 2 Normative references.7 3 Terms and definitions.8 4 Requirements for component design and component specifications.10 4.1 General requirement.10 4.2 Packaging.10 4.3 Labelling of product packaging.10 4.4 Component marking.11 4.5 Storage and transportation.12 4.6 Component outline and design.12 4.7 Mechanical stress.16 4.8 Component reliability assurance.16 4.9 Additional requirements for compatibility with lead-free soldering.16 5 Specification of assembly process conditions.16 5.1 General.16 5.2 Securing the component on the substrate prior to soldering.18 5.3 Mounting methods.19 5.4 Cleaning(where applicable).20 5.5 Removal and/or replacement of SMDs.21 6 Typical process conditions.22 6.1 Soldering processes,temperature/time profiles.22 6.2 Typical cleaning conditions for assemblies.26 7 Requirements for components and component specifications related to suitability with various mounting processes.27 7.1 General.27 7.2 Wettability.27 7.3 Resistance to dissolution of metallization.27 7.4 Resistance to soldering heat.27 7.5 Resistance to cleaning solvent.28 7.6 Soldering profiles.28 7.7 Bonding strength test for the component glue interface test.28 Bibliography.30 Figure 1 Example of a component with marked specific orientation put in tape and tray.11 Figure 2 Vacuum pipette,pick-up area and component compartment:Example for a component with a flat surface.13 Figure 3 Coplanarity of terminals.13 Figure 4 Stable seating of component.14 Figure 5 Unstable seating of component.14 Figure 6 Terminals arranged peripherally in two rows.14 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.61760-1 IEC:2006(E)3 Figure 7 Good contrast to component body and surroundings.14 Figure 8 Component weight/pipette suction strength.15 Figure 9 Process steps for sol