(总第297期)电子工业专用设备EquipmentforElectronicProductsManufacturingEEPMDec.2022收稿日期:2022-12-06生瓷坯体热切工艺研究闫文娥,高峰(中国电子科技集团公司第二研究所,山西太原030024)摘要:通过工艺实验与热切原理相结合得出影响热切质量的根本原因,提出了热切微观过程是决定热切质量的关键,通过改变热切方法能够更好地保证热切质量。并对全切工艺和半切工艺主体结构和基本原理进行了分析,指出了2种热切方法存在的精度问题和热切缺陷问题;提出了一种双面同步半切的新方法,并对该方法进行了分析,结果表明,双面同步半切能更好地解决热切质量问题。关键词:热切质量;热切微观过程;热切方法;热切缺陷;双面同步半切中图分类号:TN605文献标志码:B文章编号:1004-4507(2022)06-0035-06ResearchonThermalCuttingofGreenCemamicBarYANWen'e,GAOFeng(The2ndResearchInstituteofCETC,Taiyuan030024,China)Abstract:Thefundamentalreasonsthataffectingthermalcuttingqualityareobtainedbycombina-tionofthermalcuttingprocessexperimentanditsprincipleinthispaper.Itispointedoutthatther-malmicroprocessisthekeytodeterminethermalcuttingquality,bychangingthermalcuttingmethodcouldassurethermalcuttingqualitywell.Themainstructureandbasicprincipleoffull-cutprocessandhalf-cutprocessareanalyzed,andtheaccuracyanddefectsofthetwothermalcuttingmethodsaredescribed.Thenewmethodofdoublesidedsynchronoushalf-cutisproposed.Further-more,bymeansofanalyzingthisnewmethod,itisconcludedthatbothsidedsynchronoushalf-cutmethodcouldsolvetheproblemofthermalcuttingqualitywell.Keywords:Thermalcuttingquality;Thermalcuttingmicroscopicprocesses;Thermalcuttingmethod;Defectofthermalcutting;Doublesidedsynchronoushalf-cut在陶瓷封装工艺中,热切工艺是一个关键的工艺环节,等静压后的生瓷坯体切割成阵列产品,在生产过程中已证实该环节会出现严重影响组装工艺可靠性结果的问题,如:陶瓷封装制造钎焊工艺中的失效,存在于底棱边的热切缺陷主导的断裂会引起强度值的显著下降,下降达50~60MPa[1],先进封装技术与设备35(总第297期)电子工业专用设备EquipmentforElectronicProductsManufacturingEEPMDec.2022会对后续的钎焊组装工艺可靠性产生不利影响。热切工艺是一种单一的外形加工工艺,依靠...