IEC_60191-6-2-2001.pdf

INTERNATIONALSTANDARDIEC60191-6-2First edition2001-12Mechanical standardization of semiconductordevices Part 6-2:General rules for the preparation of outlinedrawings of surface mounted semiconductordevice packages Design guide for 1,50 mm,1,27 mm and 1,00 mmpitch ball and column terminal packagesNormalisation mcanique des dispositifs semiconducteurs Partie 6-2:Rgles gnrales pour la prparation des dessinsdencombrement des dispositifs semiconducteurspour montage en surface Guide de conception pour les botiers brochesen forme de billes et de colonnes,avec des pasde 1,50 mm,1,27 mm et 1,00 mmReference numberIEC 60191-6-2:2001(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.Publication numberingAs from 1 January 1997 all IEC publications are issued with a designation in the60000 series.For example,IEC 34-1 is now referred to as IEC 60034-1.Consolidated editionsThe IEC is now publishing consolidated versions of its publications.For example,edition numbers 1.0,1.1 and 1.2 refer,respectively,to the base publication,thebase publication incorporating amendment 1 and the base publication incorporatingamendments 1 and 2.Further information on IEC publicationsThe technical content of IEC publications is kept under constant review by the IEC,thus ensuring that the content reflects current technology.Information relating tothis publication,including its validity,is available in the IEC Catalogue ofpublications(see below)in addition to new editions,amendments and corrigenda.Information on the subjects under consideration and work in progress undertakenby the technical committee which has prepared this publication,as well as the listof publications issued,is also available from the following:IEC Web Site(www.iec.ch)Catalogue of IEC publicationsThe on-line catalogue on the IEC web site(www.iec.ch/catlg-e.htm)enablesyou to search by a variety of criteria including text searches,technicalcommittees and date of publication.On-line information is also available onrecently issued publications,withdrawn and replaced publications,as well ascorrigenda.IEC Just PublishedThis summary of recently issued publications(www.iec.ch/JP.htm)is alsoavailable by email.Please contact the Customer Service Centre(see below)forfurther information.Customer Service CentreIf you have any questions regarding this publication or need further assistance,please contact the Customer Service Centre:Email:custserviec.chTel:+41 22 919 02 11Fax:+41 22 919 03 00LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.INTERNATIONALSTANDARDIEC60191-6-2First edition2001-12Mechanical standardization of semiconductordevices Part 6-2:General rules for the preparation of outlinedrawings of surface mounted semiconductordevice packages Design guide for 1,50 mm,1,27 mm and 1,00 mmpitch ball and column terminal packagesNormalisation mcanique des dispositifs semiconducteurs Partie 6-2:Rgles gnrales pour la prparation des dessinsdencombrement des dispositifs semiconducteurspour montage en surface Guide de conception pour les botiers brochesen forme de billes et de colonnes,avec des pasde 1,50 mm,1,27 mm et 1,00 mmPRICE CODE IEC 2001 Copyright-all rights reservedNo part of this publication may be reproduced or utilized in any form or by any means,electronic ormechanical,including photocopying and microfilm,without permission in writing from the publisher.International Electrotechnical Commission3,rue de Varemb Geneva,SwitzerlandTelefax:+41 22 919 0300e-mail:inmailiec.ch IEC web site http:/www.iec.chKFor price,see current catalogue Commission Electrotechnique Internationale International Electrotechnical CommissionLICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 60191-6-2 IEC:2001(E)INTERNATIONAL ELECTROTECHNICAL COMMISSION_MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-2:General rules for the preparation of outline drawingsof surface mounted semiconductor device packages Design guide for 1,50 mm,1,27 mm and 1,00 mm pitch balland column terminal packagesFOREWORD1)The IEC(International Electrotechnical Commission)is a worldwide organization for standardization comprisingall national electrotechnical committees(IEC National Committees).The object of the IEC is to promoteinternational co-operation on all questions concerning standardization in the electrical and electronic fields.Tothis end and in addition to other activities,the IEC publishes International Standards.Their preparation isentrusted to technical committees;any IEC National Committee interested in the subject dealt with mayparticipate in this preparatory work.International,governmental and non-governmental organizations liaisingwith the IEC also participate in this preparation.The IEC collaborates closely with the InternationalOrganization for Standardization(ISO)in accordance with conditions determined by agreement be