分享
IEC_60191-1-2007.pdf
下载文档

ID:231562

大小:1.10MB

页数:42页

格式:PDF

时间:2023-03-14

收藏 分享赚钱
温馨提示:
1. 部分包含数学公式或PPT动画的文件,查看预览时可能会显示错乱或异常,文件下载后无此问题,请放心下载。
2. 本文档由用户上传,版权归属用户,汇文网负责整理代发布。如果您对本文档版权有争议请及时联系客服。
3. 下载前请仔细阅读文档内容,确认文档内容符合您的需求后进行下载,若出现内容与标题不符可向本站投诉处理。
4. 下载文档时可能由于网络波动等原因无法下载或下载错误,付费完成后未能成功下载的用户请联系客服处理。
网站客服:3074922707
IEC_60191 2007
INTERNATIONAL STANDARD IEC60191-1 Second edition2007-04 Mechanical standardization of semiconductor devices Part 1:General rules for the preparation of outline drawings of discrete devices Reference number IEC 60191-1:2007(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC,Geneva,Switzerland All rights reserved.Unless otherwise specified,no part of this publication may be reproduced or utilized in any form or by any means,electronic or mechanical,including photocopying and microfilm,without permission in writing from either IEC or IECs member National Committee in the country of the requester.If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,please contact the address below or your local IEC member National Committee for further information.IEC Central Office 3,rue de Varemb CH-1211 Geneva 20 Switzerland Email:inmailiec.ch Web:www.iec.ch About the IEC The International Electrotechnical Commission(IEC)is the leading global organization that prepares and publishes International Standards for all electrical,electronic and related technologies.About IEC publications The technical content of IEC publications is kept under constant review by the IEC.Please make sure that you have the latest edition,a corrigenda or an amendment might have been published.?Catalogue of IEC publications:www.iec.ch/searchpub The IEC on-line Catalogue enables you to search by a variety of criteria(reference number,text,technical committee,).It also gives information on projects,withdrawn and replaced publications.?IEC Just Published:www.iec.ch/online_news/justpub Stay up to date on all new IEC publications.Just Published details twice a month all new publications released.Available on-line and also by email.?Customer Service Centre:www.iec.ch/webstore/custserv If you wish to give us your feedback on this publication or need further assistance,please visit the Customer Service Centre FAQ or contact us:Email:csciec.ch Tel.:+41 22 919 02 11 Fax:+41 22 919 03 00 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.INTERNATIONAL STANDARD IEC60191-1 Second edition2007-04 Mechanical standardization of semiconductor devices Part 1:General rules for the preparation of outline drawings of discrete devices W For price,see current cataloguePRICE CODE Commission Electrotechnique InternationaleInternational Electrotechnical Commission LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 60191-1 IEC:2007(E)CONTENTS FOREWORD.4 1 Scope and object.6 2 Normative references.6 3 Terms and definitions.6 4 General rules for all drawings.8 4.1 Drawing layout.8 4.2 Dimensions and tolerances.8 4.3 Methods for locating the datum.10 4.4 Numbering of terminals.10 5 Additional rules.12 5.1 Rules for device and case outline drawings.12 5.2 Rules to specify the dimensions and positions of terminals.12 5.3 Rules for gauge drawings.13 6 Inter-conversion of inch and millimetre dimensions and rules for rounding off.13 7 Rules for coding.14 Annex A(informative)Reference letter symbols.15 Annex B(normative)Standardization philosophy.18 Annex C(informative)Rules to specify the dimensions and positions of terminals on a base drawing.23 Annex D(normative)General philosophy of flat base devices.30 Annex E(informative)Examples of semiconductor device drawing.32 Annex F(informative)Former rules for rounding off.36 Annex G(informative)Former rules for coding.38 Bibliography.39 Figure 1 Numbering of terminals of lozenge shaped bases.11 Figure 2 System to indicate the dimensions of the terminals.13 Figure B.1 Example of rigid lug device.21 Figure B.2 Example of flexible terminal device.22 Figure C.1 Circular base outline with no tab.27 Figure C.2 Tolerances of terminals.27 Figure C.3 Gauge for a circular base outline with no tab.28 Figure C.4 Circular base outline with tab.29 Figure C.5 Gauge for a circular base outline with tab.29 Figure D.1 Example of flat base outline.31 Figure E.1 Long form package.32 Figure E.2 3 types of post/stud mount packages.32 Figure E.3 2 types of cylindric packages.33 Figure E.4 Oval package,terminals in line.34 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.60191-1 IEC:2007(E)3 Figure E.5 Cylindric package with different terminations.34 Figure E.6 Flange mount package.34 Figure E.7 Disk button package with 3 terminations.35 Figure E.8 Special shape for bolt-fixture.35 Table A.1 Dimensions of reference letter symbols.15 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.4 60191-1 IEC:2007(E)INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 1:General rules for the prep

此文档下载收益归作者所有

下载文档
你可能关注的文档
收起
展开