IEC_60748-23-3-2002.pdf

INTERNATIONALSTANDARDIEC60748-23-3QC 165000-3First edition2002-05Semiconductor devices Integrated circuits Part 23-3:Hybrid integrated circuits and film structures Manufacturing line certification Manufacturers self-audit checklist and reportDispositifs semiconducteurs Circuits intgrs Partie 23-3:Circuits intgrs hybrides et structures par films Certification de la ligne de fabrication Liste de contrle et rapport dvaluation internepour fabricantsReference numberIEC 60748-23-3:2002(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.Publication numberingAs from 1 January 1997 all IEC publications are issued with a designation in the60000 series.For example,IEC 34-1 is now referred to as IEC 60034-1.Consolidated editionsThe IEC is now publishing consolidated versions of its publications.For example,edition numbers 1.0,1.1 and 1.2 refer,respectively,to the base publication,thebase publication incorporating amendment 1 and the base publication incorporatingamendments 1 and 2.Further information on IEC publicationsThe technical content of IEC publications is kept under constant review by the IEC,thus ensuring that the content reflects current technology.Information relating tothis publication,including its validity,is available in the IEC Catalogue ofpublications(see below)in addition to new editions,amendments and corrigenda.Information on the subjects under consideration and work in progress undertakenby the technical committee which has prepared this publication,as well as the listof publications issued,is also available from the following:IEC Web Site(www.iec.ch)Catalogue of IEC publicationsThe on-line catalogue on the IEC web site(www.iec.ch/catlg-e.htm)enablesyou to search by a variety of criteria including text searches,technicalcommittees and date of publication.On-line information is also available onrecently issued publications,withdrawn and replaced publications,as well ascorrigenda.IEC Just PublishedThis summary of recently issued publications(www.iec.ch/JP.htm)is alsoavailable by email.Please contact the Customer Service Centre(see below)forfurther information.Customer Service CentreIf you have any questions regarding this publication or need further assistance,please contact the Customer Service Centre:Email:custserviec.chTel:+41 22 919 02 11Fax:+41 22 919 03 00LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.INTERNATIONALSTANDARDIEC60748-23-3QC 165000-3First edition2002-05Semiconductor devices Integrated circuits Part 23-3:Hybrid integrated circuits and film structures Manufacturing line certification Manufacturers self-audit checklist and reportDispositifs semiconducteurs Circuits intgrs Partie 23-3:Circuits intgrs hybrides et structures par films Certification de la ligne de fabrication Liste de contrle et rapport dvaluation internepour fabricants IEC 2002 Copyright-all rights reservedNo part of this publication may be reproduced or utilized in any form or by any means,electronic ormechanical,including photocopying and microfilm,without permission in writing from the publisher.International Electrotechnical Commission,3,rue de Varemb,PO Box 131,CH-1211 Geneva 20,SwitzerlandTelephone:+41 22 919 02 11 Telefax:+41 22 919 03 00 E-mail:inmailiec.ch Web:www.iec.chFor price,see current cataloguePRICE CODECommission Electrotechnique InternationaleInternational Electrotechnical Commission XCLICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 60748-23-3 IEC:2002(E)CONTENTSFOREWORD.4INTRODUCTION.51Scope.62Document information.62.1General.62.2Normative references.63Definitions.74General requirements.74.1Self-audit checklist and report for thick and thin filmhybrid integrated circuit manufacturers.84.2Description of report/company structure.94.3Approval information.104.4Summary of testing.124.5Analytical methods.144.6Control of procurement sources and incoming material.154.7Control of procurement sources and incoming material,continued.154.8Environmental control and static handling.164.9Change notification requirements.174.10 Hybrid design.175Thick film processing.195.1Artwork and screen fabrication.195.2Substrates.205.3Substrate saw or scribe and break and substrate hole drilling.215.4Thick film pastes and printing.225.5Drying and firing.265.6Resistor trimming.275.7Inspection and test of processing.285.8Rework.296Thin film processing.306.1Artwork and mask fabrication.306.2Substrates.316.3Substrate saw or scribe and break and substrate hole drilling.336.4Thin film processing materials and pattern forming.336.5Drying and stabilization.356.6Resistor trimming.366.7Rework.377Hybrid assembly.387.1Solder assembly.397.2Chip and wire assembly.468Test and dispatch.578.1Electrical tests.588.2Burn-in.598.3Endurance.618.4Dry heat(stabilization bake).628.5Change of temperature.63LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL U