IEC_60748-23-2-2002.pdf

INTERNATIONALSTANDARDIEC60748-23-2QC 165000-2First edition2002-05Semiconductor devices Integrated circuits Part 23-2:Hybrid integrated circuits and film structures Manufacturing line certification Internal visual inspection and special testsDispositifs semiconducteurs Circuits intgrs Partie 23-2:Circuits intgrs hybrides et structures par films Certification de la ligne de fabrication Contrle visuel interne et essais spciauxReference numberIEC 60748-23-2:2002(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.Publication numberingAs from 1 January 1997 all IEC publications are issued with a designation in the60000 series.For example,IEC 34-1 is now referred to as IEC 60034-1.Consolidated editionsThe IEC is now publishing consolidated versions of its publications.For example,edition numbers 1.0,1.1 and 1.2 refer,respectively,to the base publication,thebase publication incorporating amendment 1 and the base publication incorporatingamendments 1 and 2.Further information on IEC publicationsThe technical content of IEC publications is kept under constant review by the IEC,thus ensuring that the content reflects current technology.Information relating tothis publication,including its validity,is available in the IEC Catalogue ofpublications(see below)in addition to new editions,amendments and corrigenda.Information on the subjects under consideration and work in progress undertakenby the technical committee which has prepared this publication,as well as the listof publications issued,is also available from the following:IEC Web Site(www.iec.ch)Catalogue of IEC publicationsThe on-line catalogue on the IEC web site(www.iec.ch/catlg-e.htm)enablesyou to search by a variety of criteria including text searches,technicalcommittees and date of publication.On-line information is also available onrecently issued publications,withdrawn and replaced publications,as well ascorrigenda.IEC Just PublishedThis summary of recently issued publications(www.iec.ch/JP.htm)is alsoavailable by email.Please contact the Customer Service Centre(see below)forfurther information.Customer Service CentreIf you have any questions regarding this publication or need further assistance,please contact the Customer Service Centre:Email:custserviec.chTel:+41 22 919 02 11Fax:+41 22 919 03 00LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.INTERNATIONALSTANDARDIEC60748-23-2QC165000-2First edition2002-05Semiconductor devices Integrated circuits Part 23-2:Hybrid integrated circuits and film structures Manufacturing line certification Internal visual inspection and special testsDispositifs semiconducteurs Circuits intgrs Partie 23-2:Circuits intgrs hybrides et structures par films Certification de la ligne de fabrication Contrle visuel interne et essais spciaux IEC 2002 Copyright-all rights reservedNo part of this publication may be reproduced or utilized in any form or by any means,electronic ormechanical,including photocopying and microfilm,without permission in writing from the publisher.International Electrotechnical Commission,3,rue de Varemb,PO Box 131,CH-1211 Geneva 20,SwitzerlandTelephone:+41 22 919 02 11 Telefax:+41 22 919 03 00 E-mail:inmailiec.ch Web:www.iec.chXDFor price,see current cataloguePRICE CODECommission Electrotechnique InternationaleInternational Electrotechnical Commission LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 60748-23-2 IEC:2002(E)CONTENTSFOREWORD.7INTRODUCTION.91Scope.102Normative references.103Definitions.114Apparatus.185Procedure.185.1General.185.2Sequence of inspection.195.3Inspection control.195.4Re-inspection.195.5Exclusions.195.6Magnification.195.7Format and conventions.195.8Interpretations.206Thin film element inspection.206.1Operating metallization non-conformances high magnification.206.2Passivation non-conformances high magnification.266.3Glassivation non-conformances,high magnification.276.4Substrate non-conformances high magnification.286.5Foreign material non-conformances low magnification.306.6Thin film resistor non-conformances,high magnification.316.7Laser trimmed thin film resistor non-conformances,high magnification.366.8Multilevel thin film non-conformances,high magnification.456.9Coupling(air)bridge non-conformances high magnification.457Planar thick film element inspection.477.1Operating metallization non-conformances low magnification.477.2Substrate non-conformances,low magnification.517.3Thick film resistor non-conformances,low magnification.547.4Trimmed thick film resistor non-conformances,low magnification.567.5Multilevel thick film non-conformances,low magnification.587.6All thin film capacitors and overlay capacitors used in GaAs microwavedevices,low magnification.598Active and passive elements.599Element attachment(assembly),magnification 10 to 60.599.1Solder connections(general appearance).599.2Elemen