IEC_61188-5-3-2007.pdf

IEC 61188-5-3Edition 1.0 2007-10INTERNATIONAL STANDARD Printed boards and printed board assemblies Design and use Part 5-3:Attachment(land/joint)considerations Components with gull-wing leads on two sides IEC 61188-5-3:2007(E)LICENSED TO MECON Limited.-RANCHI/BANGALORE,FOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC,Geneva,Switzerland All rights reserved.Unless otherwise specified,no part of this publication may be reproduced or utilized in any form or by any means,electronic or mechanical,including photocopying and microfilm,without permission in writing from either IEC or IECs member National Committee in the country of the requester.If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,please contact the address below or your local IEC member National Committee for further information.IEC Central Office 3,rue de Varemb CH-1211 Geneva 20 Switzerland Email:inmailiec.ch Web:www.iec.ch About the IEC The International Electrotechnical Commission(IEC)is the leading global organization that prepares and publishes International Standards for all electrical,electronic and related technologies.About IEC publications The technical content of IEC publications is kept under constant review by the IEC.Please make sure that you have the latest edition,a corrigenda or an amendment might have been published.?Catalogue of IEC publications:www.iec.ch/searchpub The IEC on-line Catalogue enables you to search by a variety of criteria(reference number,text,technical committee,).It also gives information on projects,withdrawn and replaced publications.?IEC Just Published:www.iec.ch/online_news/justpub Stay up to date on all new IEC publications.Just Published details twice a month all new publications released.Available on-line and also by email.?Electropedia:www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions in English and French,with equivalent terms in additional languages.Also known as the International Electrotechnical Vocabulary online.?Customer Service Centre:www.iec.ch/webstore/custserv If you wish to give us your feedback on this publication or need further assistance,please visit the Customer Service Centre FAQ or contact us:Email:csciec.ch Tel.:+41 22 919 02 11 Fax:+41 22 919 03 00 LICENSED TO MECON Limited.-RANCHI/BANGALORE,FOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.IEC 61188-5-3Edition 1.0 2007-10INTERNATIONAL STANDARD Printed boards and printed board assemblies Design and use Part 5-3:Attachment(land/joint)considerations Components with gull-wing leads on two sides INTERNATIONAL ELECTROTECHNICAL COMMISSION UICS 31.180 PRICE CODEISBN 2-8318-9340-2LICENSED TO MECON Limited.-RANCHI/BANGALORE,FOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 61188-5-3 IEC:2007(E)CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope.7 2 Normative references.7 3 General information.7 3.1 General component description.7 3.2 Marking.7 3.3 Carrier packaging format.7 3.4 Process considerations.7 4 TSOP(Type 1).8 4.1 Field of application.8 4.2 Component description.8 4.3 Component dimensions.8 4.4 Solder joint fillet design.9 4.5 Land pattern dimensions.11 5 TSOP(Type 2).13 5.1 Field of application.13 5.2 Component description.13 5.3 Component dimensions.13 5.4 Solder joint fillet design.14 5.5 Land pattern dimensions.16 6 SOP.18 6.1 Field of application.18 6.2 Component description.18 6.3 Component dimensions.18 6.4 Solder joint fillet design.19 6.5 Land pattern dimensions.21 7 SSOP.23 7.1 Field of application.23 7.2 Component description.23 7.3 Component dimensions.24 7.4 Solder joint fillet design.24 7.5 Land pattern dimensions.26 Bibliography.29 Figure 1 TSOP(Type 1)construction.8 Figure 2 TSOP(Type 1)Component dimensions.9 Figure 3 Solder joint fillet design(see IEC 61188-5-1,Tables 2 and 3).11 Figure 4 TSOP(Type 1)Land pattern dimensions.13 Figure 5 TSOP(Type 2)construction.13 Figure 6 TSOP(Type 2)Component dimensions.14 Figure 7 Solder joint fillet design(see IEC 61188-5-1,Tables 2 and 3).16 Figure 8 TSOP(Type 2)Land pattern dimensions.18 LICENSED TO MECON Limited.-RANCHI/BANGALORE,FOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.61188-5-3 IEC:2007(E)3 Figure 9 SOPIC construction.18 Figure 10 SOP component dimensions.19 Figure 11 Solder joint fillet design(see IEC 61188-5-1,Table 2).21 Figure 12 SOP Land pattern dimensions.23 Figure 13 SSOP construction.23 Figure 14 Component dimensions.24 Figure 15 Solder joint fillet design(see IEC 61188-5-1,Table 2).26 Figure 16 Land pattern dimensions.28 LICENSED TO MECON Limited.-RANCHI/BANGALORE,FOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.4 61188-5-3 IEC:2007(E)INTERNATIONAL ELECTROTECHNICAL COMMISSION _ PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES DESIGN AND USE Part 5-3:Attac