IEC_61189-3-2007.pdf

IEC 61189-3Edition 2.0 2007-10INTERNATIONAL STANDARD Test methods for electrical materials,printed boards and other interconnection structures and assemblies Part 3:Test methods for interconnection structures(printed boards)IEC 61189-3:2007(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC,Geneva,Switzerland All rights reserved.Unless otherwise specified,no part of this publication may be reproduced or utilized in any form or by any means,electronic or mechanical,including photocopying and microfilm,without permission in writing from either IEC or IECs member National Committee in the country of the requester.If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,please contact the address below or your local IEC member National Committee for further information.IEC Central Office 3,rue de Varemb CH-1211 Geneva 20 Switzerland Email:inmailiec.ch Web:www.iec.ch About the IEC The International Electrotechnical Commission(IEC)is the leading global organization that prepares and publishes International Standards for all electrical,electronic and related technologies.About IEC publications The technical content of IEC publications is kept under constant review by the IEC.Please make sure that you have the latest edition,a corrigenda or an amendment might have been published.?Catalogue of IEC publications:www.iec.ch/searchpub The IEC on-line Catalogue enables you to search by a variety of criteria(reference number,text,technical committee,).It also gives information on projects,withdrawn and replaced publications.?IEC Just Published:www.iec.ch/online_news/justpub Stay up to date on all new IEC publications.Just Published details twice a month all new publications released.Available on-line and also by email.?Electropedia:www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions in English and French,with equivalent terms in additional languages.Also known as the International Electrotechnical Vocabulary online.?Customer Service Centre:www.iec.ch/webstore/custserv If you wish to give us your feedback on this publication or need further assistance,please visit the Customer Service Centre FAQ or contact us:Email:csciec.ch Tel.:+41 22 919 02 11 Fax:+41 22 919 03 00 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.IEC 61189-3Edition 2.0 2007-10INTERNATIONAL STANDARD Test methods for electrical materials,printed boards and other interconnection structures and assemblies Part 3:Test methods for interconnection structures(printed boards)INTERNATIONAL ELECTROTECHNICAL COMMISSION XEICS 31.180 PRICE CODEISBN 2-8318-9324-0LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 61189-3 IEC:2007(E)CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope and object.7 2 Normative references.7 3 Accuracy,precision and resolution.8 4 Catalogue of approved test methods.11 5 P:Preparation/conditioning test methods.11 6 V:Visual test methods.11 7 D:Dimensional test methods.14 8 C:Chemical test methods.17 9 M:Mechanical test methods.30 10 E:Electrical test methods.48 11 N:Environmental test methods.75 12 X:Miscellaneous test methods.93 Annex A(informative)Worked examples.117 Figure 1 Glow wire.19 Figure 2 Test apparatus.20 Figure 3a Horizontal specimen Flame applied to surface.24 Figure 3b Horizontal specimen Flame applied to edge.24 Figure 3c Vertical specimen Lower edge horizontal Flame applied to edge.25 Figure 3d Vertical specimen Lower edge horizontal Flame applied to surface.25 Figure 3e Needle burner test Side views of test board and burner.26 Figure 3 Needle burner test.26 Figure 4 Flux type classification by copper mirror test.30 Figure 5 Copper foil for peel test.33 Figure 5a Hold down clamping system.32 Figure 5b Single load mode.32 Figure 5c Multiple load mode.32 Figure 5d Keyhole hold down fixture.33 Figure 6 Bow.36 Figure 7 Twist.36 Figure 8 Test set-up for bow measurement.37 Figure 9 Specimen set-up for twist measurement.37 Figure 10a Specimen set-up for referee test for twist,raised parallel surfaces.39 Figure 10b Specimen setup for referee test for twist,supporting jacks or blocks.39 Figure 10c Specimen setup for referee test for twist measurements.39 Figure 10 Specimen setup for referee test.39 Figure 11 Bow measurement.40 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.61189-3 IEC:2007(E)3 Figure 12 Twist measurement.40 Figure 13 Measuring equipment for peel strength of flexible printed boards.43 Figure 14 Pencil holder.46 Figure 15a Location of test specimens.54 Figure 15b Location of test specimens.55 Figure 15 Composite test pattern.55 Figure 16 Test specimen artwork.61 Figu