IEC_61189-2-2006.pdf

INTERNATIONAL STANDARD IEC61189-2 Second edition2006-05 Test methods for electrical materials,printed boards and other interconnection structures and assemblies Part 2:Test methods for materials for interconnection structures Reference number IEC 61189-2:2006(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.Publication numbering As from 1 January 1997 all IEC publications are issued with a designation in the 60000 series.For example,IEC 34-1 is now referred to as IEC 60034-1.Consolidated editions The IEC is now publishing consolidated versions of its publications.For example,edition numbers 1.0,1.1 and 1.2 refer,respectively,to the base publication,the base publication incorporating amendment 1 and the base publication incorporating amendments 1 and 2.Further information on IEC publications The technical content of IEC publications is kept under constant review by the IEC,thus ensuring that the content reflects current technology.Information relating to this publication,including its validity,is available in the IEC Catalogue of publications(see below)in addition to new editions,amendments and corrigenda.Information on the subjects under consideration and work in progress undertaken by the technical committee which has prepared this publication,as well as the list of publications issued,is also available from the following:IEC Web Site(www.iec.ch)Catalogue of IEC publications The on-line catalogue on the IEC web site(www.iec.ch/searchpub)enables you to search by a variety of criteria including text searches,technical committees and date of publication.On-line information is also available on recently issued publications,withdrawn and replaced publications,as well as corrigenda.IEC Just Published This summary of recently issued publications(www.iec.ch/online_news/justpub)is also available by email.Please contact the Customer Service Centre(see below)for further information.Customer Service Centre If you have any questions regarding this publication or need further assistance,please contact the Customer Service Centre:Email:custserviec.ch Tel:+41 22 919 02 11 Fax:+41 22 919 03 00 LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.INTERNATIONAL STANDARD IEC61189-2 Second edition2006-05 Test methods for electrical materials,printed boards and other interconnection structures and assemblies Part 2:Test methods for materials for interconnection structures IEC 2006 Copyright-all rights reserved No part of this publication may be reproduced or utilized in any form or by any means,electronic or mechanical,including photocopying and microfilm,without permission in writing from the publisher.International Electrotechnical Commission,3,rue de Varemb,PO Box 131,CH-1211 Geneva 20,SwitzerlandTelephone:+41 22 919 02 11 Telefax:+41 22 919 03 00 E-mail:inmailiec.ch Web:www.iec.ch XF For price,see current cataloguePRICE CODE Commission Electrotechnique InternationaleInternational Electrotechnical Commission LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 61189-2 IEC:2006(E)CONTENTS FOREWORD.6 INTRODUCTION.8 1 Scope.9 2 Normative references.9 3 Accuracy,precision and resolution.9 3.1 Accuracy.10 3.2 Precision.10 3.3 Resolution.11 3.4 Report.11 3.5 Students t distribution.11 3.6 Suggested uncertainty limits.12 4 Catalogue of approved test methods.13 5 P:Preparation/conditioning test methods.13 5.1 Test 2P01:Dry heat(under consideration).13 5.2 Test 2P02:Solder float stress(under consideration).13 6 V:Visual test methods.13 7 D:Dimensional test methods.13 7.1 Test 2D01:Thickness of base materials and rigid boards.13 8 C:Chemical test methods.15 8.1 Test 2C01:Resistance to sodium hydroxide of base materials.15 8.2 Test 2C02:Gel time of epoxy based prepreg materials.16 8.3 Test 2C03:Resin content of prepreg materials by treated weight.17 8.4 Test 2C04:Volatile content of prepreg materials.19 8.5 Test 2C05:Blistering during heat shock.21 8.6 Test 2C06:Flammability,vertical burning test for rigid materials.23 8.7 Test 2C07:Flammability;horizontal burning test for rigid materials.26 8.8 Test 2C08:Flammability,flex material.29 8.9 Test 2C09:Melting viscosity of prepreg materials.33 8.10 Test 2C10:Resin content of prepreg materials by sublimation.35 8.11 Test 2C11:UV blocking characteristics of laminates.37 8.12 Test 2C12:Total halogen content in base materials.38 9 M:Mechanical test methods.42 9.1 Test 2M01:Test method for bow and twist.42 9.2 Test 2M02:Bow/twist after etching and heating.43 9.3 Test 2M03:Cure factor of base materials by differential scanning calorimetry(DSC)or thermomechanical analysis(TMA).45 9.4 Test 2M04:Twist after heating(under consideration).46 9.5 Test 2M05:Pull-off strength.46 9.6 Test 2M06:Peel strength after exposure to solvent vapour.48 9.7 Test 2M07:Peel strength after immersion in solvent.50 9.8 Test 2M08:Flexur