IEC_60191-6-3-2000.pdf

INTERNATIONALSTANDARDIEC60191-6-3First edition2000-09Mechanical standardization ofsemiconductor devices Part 6-3:General rules for the preparation ofoutline drawings of surface mountedsemiconductor device packages Measuring methods for package dimensionsof quad flat packs(QFP)Normalisation mcanique des dispositifs semiconducteurs Partie 6-3:Rgles gnrales pour la prparation des dessinsdencombrement des dispositifs semiconducteurs montage en surface Mthodes de mesure pourles botiers plats quadrangulaires(QFP)Reference numberIEC 60191-6-3:2000(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.NumberingAs from 1 January 1997 all IEC publications are issued with a designation in the60000 series.Consolidated publicationsConsolidated versions of some IEC publications including amendments areavailable.For example,edition numbers 1.0,1.1 and 1.2 refer,respectively,to thebase publication,the base publication incorporating amendment 1 and the basepublication incorporating amendments 1 and 2.Validity of this publicationThe technical content of IEC publications is kept under constant review by the IEC,thus ensuring that the content reflects current technology.Information relating to the date of the reconfirmation of the publication is availablein the IEC catalogue.Information on the subjects under consideration and work in progress undertakenby the technical committee which has prepared this publication,as well as the listof publications issued,is to be found at the following IEC sources:IEC web site*Catalogue of IEC publicationsPublished yearly with regular updates(On-line catalogue)*IEC BulletinAvailable both at the IEC web site*and as a printed periodicalTerminology,graphical and letter symbolsFor general terminology,readers are referred to IEC 60050:InternationalElectrotechnical Vocabulary(IEV).For graphical symbols,and letter symbols and signs approved by the IEC forgeneral use,readers are referred to publications IEC 60027:Letter symbols to beused in electrical technology,IEC 60417:Graphical symbols for use on equipment.Index,survey and compilation of the single sheets and IEC 60617:Graphical symbolsfor diagrams.*See web site address on title page.LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.INTERNATIONALSTANDARDIEC60191-6-3First edition2000-09Mechanical standardization ofsemiconductor devices Part 6-3:General rules for the preparation ofoutline drawings of surface mountedsemiconductor device packages Measuring methods for package dimensionsof quad flat packs(QFP)Normalisation mcanique des dispositifs semiconducteurs Partie 6-3:Rgles gnrales pour la prparation des dessinsdencombrement des dispositifs semiconducteurs montage en surface Mthodes de mesure pourles botiers plats quadrangulaires(QFP)PRICE CODE IEC 2000 Copyright-all rights reservedNo part of this publication may be reproduced or utilized in any form or by any means,electronic ormechanical,including photocopying and microfilm,without permission in writing from the publisher.International Electrotechnical Commission3,rue de Varemb Geneva,SwitzerlandTelefax:+41 22 919 0300e-mail:inmailiec.ch IEC web site http:/www.iec.chQFor price,see current catalogue Commission Electrotechnique Internationale International Electrotechnical CommissionLICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 60191-6-3 IEC:2000(E)INTERNATIONAL ELECTROTECHNICAL COMMISSION_MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-3:General rules for the preparation of outline drawingsof surface mounted semiconductor device packages Measuring methods for package dimensions of quad flat packs(QFP)FOREWORD1)The IEC(International Electrotechnical Commission)is a worldwide organization for standardization comprisingall national electrotechnical committees(IEC National Committees).The object of the IEC is to promoteinternational co-operation on all questions concerning standardization in the electrical and electronic fields.Tothis end and in addition to other activities,the IEC publishes International Standards.Their preparation isentrusted to technical committees;any IEC National Committee interested in the subject dealt with mayparticipate in this preparatory work.International,governmental and non-governmental organizations liaisingwith the IEC also participate in this preparation.The IEC collaborates closely with the InternationalOrganization for Standardization(ISO)in accordance with conditions determined by agreement between thetwo organizations.2)The formal decisions or agreements of the IEC on technical matters express,as nearly as possible,aninternational consensus of opinion on the relevant subjects since each technical committee has representationfrom all interested National Committees.3)The documents produced have the form of recommendations for international use and are published i