IEC_60191-6-4-2003.pdf

INTERNATIONALSTANDARDIEC60191-6-4First edition2003-06Mechanical standardization ofsemiconductor devices Part 6-4:General rules for the preparation ofoutline drawings of surface mountedsemiconductor device packages Measuring methods for packagedimensions of ball grid array(BGA)Normalisation mcanique des dispositifs semiconducteurs Partie 6-4:Rgles gnrales pour la prparation des dessinsdencombrement des dispositifs semiconducteurs montage en surface Mthodes de mesure pour les dimensions des botiersmatriciels billesReference numberIEC 60191-6-4:2003(E)LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.Publication numberingAs from 1 January 1997 all IEC publications are issued with a designation in the60000 series.For example,IEC 34-1 is now referred to as IEC 60034-1.Consolidated editionsThe IEC is now publishing consolidated versions of its publications.For example,edition numbers 1.0,1.1 and 1.2 refer,respectively,to the base publication,thebase publication incorporating amendment 1 and the base publication incorporatingamendments 1 and 2.Further information on IEC publicationsThe technical content of IEC publications is kept under constant review by the IEC,thus ensuring that the content reflects current technology.Information relating tothis publication,including its validity,is available in the IEC Catalogue ofpublications(see below)in addition to new editions,amendments and corrigenda.Information on the subjects under consideration and work in progress undertakenby the technical committee which has prepared this publication,as well as the listof publications issued,is also available from the following:IEC Web Site(www.iec.ch)Catalogue of IEC publicationsThe on-line catalogue on the IEC web site(http:/www.iec.ch/searchpub/cur_fut.htm)enables you to search by a variety of criteria including text searches,technicalcommittees and date of publication.On-line information is also available onrecently issued publications,withdrawn and replaced publications,as well ascorrigenda.IEC Just Published This summary of recently issued publications(http:/www.iec.ch/online_news/justpub/jp_entry.htm)is also available by email.Please contact the CustomerService Centre(see below)for further information.Customer Service CentreIf you have any questions regarding this publication or need further assistance,please contact the Customer Service Centre:Email:custserviec.chTel:+41 22 919 02 11Fax:+41 22 919 03 00LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.INTERNATIONALSTANDARDIEC60191-6-4First edition2003-06Mechanical standardization ofsemiconductor devices Part 6-4:General rules for the preparation ofoutline drawings of surface mountedsemiconductor device packages Measuring methods for packagedimensions of ball grid array(BGA)Normalisation mcanique des dispositifs semiconducteurs Partie 6-4:Rgles gnrales pour la prparation des dessinsdencombrement des dispositifs semiconducteurs montage en surface Mthodes de mesure pour les dimensions des botiersmatriciels billes IEC 2003 Copyright-all rights reservedNo part of this publication may be reproduced or utilized in any form or by any means,electronic ormechanical,including photocopying and microfilm,without permission in writing from the publisher.International Electrotechnical Commission,3,rue de Varemb,PO Box 131,CH-1211 Geneva 20,SwitzerlandTelephone:+41 22 919 02 11 Telefax:+41 22 919 03 00 E-mail:inmailiec.ch Web:www.iec.chPFor price,see current cataloguePRICE CODECommission Electrotechnique InternationaleInternational Electrotechnical Commission LICENSED TO MECON Limited.-RANCHI/BANGALOREFOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 60191-6-4 IEC:2003(E)CONTENTSFOREWORD.31Scope.42Normative references.43Terms and definitions.44Reference character and drawings.54.1Ball grid array package(BGA)Type 1 Ball datum.54.2Ball grid array package(BGA)Type 2 Body datum.6Measuring method.75.1Datum S as pertaining to ball coplanarity.75.2Datum A,B.75.3Definition of specified dimensions and measuring method.95.4Profile of a package edge surface v.115.5Mounting height A.125.6First stand-off A1.125.7Second stand-off A4.135.8Ball diameter b.145.9Ball centre position X.145.10 Ball coplanarity y.165.11 Package top flatness y1.16Figure 1 BGA package Type 1 Ball datum.5Figure 2 BGA package Type 2 Body datum.6Figure 3 Datum S.7Figure 4 Datum A,B Type 1.8Figure 5 Centre of ball centres(for an even number).8Figure 6 Centre of ball centres(for an odd number).8Figure 7 Datum A Type 2.9Figure 8 Datum B Type 2.9Figure 9 Tolerance w.10Figure 10 Measuring method of tolerance w.10Figure 11 Profile of a package edge surface v.11Figure 12 Measuring method of package edge surface v.11Figure 13 Mounting height A.12Figure 14 First stand-off A1.12Figure 15 Measuring method of stand-off A1.13Figure 16 Second stand-off A4.13Figure 17 Measuring method of stand-off A4.