IEC_60068-2-20-2008.pdf

IEC 60068-2-20Edition 5.0 2008-07INTERNATIONAL STANDARD Environmental testing Part 2-20:Tests Test T:Test methods for solderability and resistance to soldering heat of devices with leads IEC 60068-2-20:2008(E)LICENSED TO MECON Limited.-RANCHI/BANGALORE,FOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2008 IEC,Geneva,Switzerland All rights reserved.Unless otherwise specified,no part of this publication may be reproduced or utilized in any form or by any means,electronic or mechanical,including photocopying and microfilm,without permission in writing from either IEC or IECs member National Committee in the country of the requester.If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,please contact the address below or your local IEC member National Committee for further information.IEC Central Office 3,rue de Varemb CH-1211 Geneva 20 Switzerland Email:inmailiec.ch Web:www.iec.ch About the IEC The International Electrotechnical Commission(IEC)is the leading global organization that prepares and publishes International Standards for all electrical,electronic and related technologies.About IEC publications The technical content of IEC publications is kept under constant review by the IEC.Please make sure that you have the latest edition,a corrigenda or an amendment might have been published.?Catalogue of IEC publications:www.iec.ch/searchpub The IEC on-line Catalogue enables you to search by a variety of criteria(reference number,text,technical committee,).It also gives information on projects,withdrawn and replaced publications.?IEC Just Published:www.iec.ch/online_news/justpub Stay up to date on all new IEC publications.Just Published details twice a month all new publications released.Available on-line and also by email.?Electropedia:www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions in English and French,with equivalent terms in additional languages.Also known as the International Electrotechnical Vocabulary online.?Customer Service Centre:www.iec.ch/webstore/custserv If you wish to give us your feedback on this publication or need further assistance,please visit the Customer Service Centre FAQ or contact us:Email:csciec.ch Tel.:+41 22 919 02 11 Fax:+41 22 919 03 00 LICENSED TO MECON Limited.-RANCHI/BANGALORE,FOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.IEC 60068-2-20Edition 5.0 2008-07INTERNATIONAL STANDARD Environmental testing Part 2-20:Tests Test T:Test methods for solderability and resistance to soldering heat of devices with leads INTERNATIONAL ELECTROTECHNICAL COMMISSION RICS 19.040 PRICE CODEISBN 2-8318-9919-2 Registered trademark of the International Electrotechnical Commission LICENSED TO MECON Limited.-RANCHI/BANGALORE,FOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.2 60068-2-20 IEC:2008(E)CONTENTS FOREWORD.4 1 Scope and object.6 2 Normative references.6 3 Terms and definitions.7 4 Test Ta:Solderability of wire and tag terminations.8 4.1 Object and general description of the test.8 4.1.1 Test methods.8 4.1.2 Specimen preparation.8 4.1.3 Initial measurements.9 4.1.4 Accelerated ageing.9 4.2 Method 1:Solder bath.9 4.2.1 Description of the solder bath.9 4.2.2 Flux.10 4.2.3 Procedure.10 4.2.4 Test conditions.10 4.2.5 Final measurements and requirements.11 4.3 Method 2:Soldering iron at 350 C.11 4.3.1 Description of soldering irons.11 4.3.2 Solder and flux.12 4.3.3 Procedure.12 4.3.4 Final measurements and requirements.13 4.4 Information to be given in the relevant specification.13 5 Test Tb:Resistance to soldering heat.13 5.1 Object and general description of the test.13 5.1.1 Test methods.13 5.1.2 Initial measurements.14 5.2 Method 1:Solder bath.14 5.2.1 Description of the solder bath.14 5.2.2 Flux.14 5.2.3 Procedure.14 5.2.4 Test conditions.14 5.2.5 De-wetting.15 5.3 Method 2:Soldering iron.15 5.3.1 Description of soldering iron.15 5.3.2 Solder and flux.15 5.3.3 Procedure.15 5.4 Recovery.16 5.5 Final measurements and requirements.16 5.6 De-wetting(if applicable).16 5.7 Information to be given in the relevant specification.17 Annex A(informative)Example of apparatus for accelerated steam ageing process.18 Annex B(normative)Specification for flux constituents.19 Bibliography.20 Figure 1 Diagram of contact angle.7 LICENSED TO MECON Limited.-RANCHI/BANGALORE,FOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.60068-2-20 IEC:2008(E)3 Figure 2 Position of soldering iron.12 Figure A.1 Example of apparatus.18 Table 1 Solderability,Solder bath method:Test severities(duration and temperature).11 Table 2 Resistance to soldering heat,Solder bath method:Test severities(duration and temperature).15 LICENSED TO MECON Limited.-RANCHI/BANGALORE,FOR INTERNAL USE AT THIS LOCATION ONLY,SUPPLIED BY BOOK SUPPLY BUREAU.4 60068-2-20