Designation:F72–95(Reapproved2001)StandardSpecificationforGoldWireforSemiconductorLeadBonding1ThisstandardisissuedunderthefixeddesignationF72;thenumberimmediatelyfollowingthedesignationindicatestheyearoforiginaladoptionor,inthecaseofrevision,theyearoflastrevision.Anumberinparenthesesindicatestheyearoflastreapproval.Asuperscriptepsilon(e)indicatesaneditorialchangesincethelastrevisionorreapproval.1.Scope1.1Thisspecificationcoversrounddrawn/extrudedgoldwireforinternalsemiconductordeviceelectricalconnections.Fourclassificationsofwirearedistinguished,(1)copper-modifiedwire,(2)beryllium-modifiedwire,(3)high-strengthwire,and(4)specialpurposewire.NOTE1—Tracemetallicelementshaveasignificanteffectuponthemechanicalpropertiesandthermalstabilityofhigh-puritygoldwire.Itiscustomaryinmanufacturingtoaddcontrolledamountsofselectedimpuritiestogoldtomodifyorstabilizebondingwirepropertiesorboth.Thispracticeisknownvariouslyas“modifying,”“stabilizing,”or“doping.”Thefirsttwowireclassificationsdenotedinthisspecificationrefertowiremadewitheitheroftwoparticularmodifiers,copperorberyllium,ingeneraluse.Inthethirdandfourthwireclassifications,“high-strength”and“specialpurpose”wire,theidentityofmodifyingadditivesisnotrestricted.1.2ThevaluesstatedinSIunitsshallberegardedasthestandard.1.2.1Amixedsystemofmetricandinch-poundunitsisinwidespreaduseforspecifyingsemiconductorlead-bondingwire.SI-equivalentvaluesofothercommonlyusedunitsaredenotedbyparenthesesintextandtables.1.3Thefollowinghazardcaveatpertainsonlytothetestmethodportion,Section9,ofthisspecification.Thisstandarddoesnotpurporttoaddressallofthesafetyconcerns,ifany,associatedwithitsuse.Itistheresponsibilityoftheuserofthisstandardtoestablishappropriatesafetyandhealthpracticesanddeterminetheapplicabilityofregulatorylimitationspriortouse.2.ReferencedDocuments2.1ASTMStandards:F16TestMethodsforMeasuringDiameterorThicknessofWireandRibbonforElectronicDevicesandLamps2F205TestMethodforMeasuringDiameterofFineWirebyWeighing2F219TestMethodsofT...
