Designation:F638–88(Reapproved2001)StandardSpecificationforFineAluminum—1%MagnesiumWireforSemiconductorLead-Bonding1ThisstandardisissuedunderthefixeddesignationF638;thenumberimmediatelyfollowingthedesignationindicatestheyearoforiginaladoptionor,inthecaseofrevision,theyearoflastrevision.Anumberinparenthesesindicatestheyearoflastreapproval.Asuperscriptepsilon(e)indicatesaneditorialchangesincethelastrevisionorreapproval.1.Scope1.1Thisspecificationcoversaluminum-1%magnesiumal-loywireforinternalconnectionsinsemiconductordevicesandislimitedtowiresofdiameteruptoandincluding0.002in.(0.051mm).Fordiameterslargerthan0.0020in.(0.051mm),thespecificationsaretobeagreeduponbetweenthepurchaserandthesupplier.1.2Thevaluesstatedininch-poundunitsaretoberegardedasthestandard.Thevaluesstatedinparenthesesareforinformationonly.2.ReferencedDocuments2.1ASTMStandards:F16TestMethodsforMeasuringDiameterorThicknessofWireandRibbonforElectronicDevicesandLamps2F72SpecificationforGoldWireforSemiconductorLeadBonding2F205TestMethodforMeasuringDiameterofFineWirebyWeighing2F219TestMethodsofTestingFineRoundandFlatWireforElectronDevicesandLampsF584PracticeforVisualInspectionofSemiconductorLeadBondingWire22.2MilitaryStandard:MIL-STD-105SamplingProceduresandTablesforInspec-tionbyAttributes33.OrderingInformation3.1Ordersformaterialunderthisspecificationshallincludethefollowinginformation:3.1.1Quantity,3.1.2Composition(seeSection7),3.1.3Size(diameter)(seeSection5),3.1.4Breakingloadandelongation(seeSection4),3.1.5Spooling,packaging,andmarking(seeSection11),3.1.6Buyerpartnumber,and3.1.7Specialrequirementssuchasforcertificateofcompli-ance(seeSection10).4.PhysicalRequirements4.1Elongationandbreakingloadrangesforthewireshallbespecifiedbythepurchaser.ThemaximumrangesofthemechanicalpropertiesarelistedinTable1.4.2MechanicalpropertyrequirementsinrangessmallerthanthoselistedinTable1maybespecifieduponagreementbetweenthepurchaserandthesupplier.NOTE1—Thenatureofaluminum-1%magnesiumalloyissuchthatthemechanicalproperti...
