Designation:F1709−97(Reapproved2008)StandardSpecificationforHighPurityTitaniumSputteringTargetsforElectronicThinFilmApplications1ThisstandardisissuedunderthefixeddesignationF1709;thenumberimmediatelyfollowingthedesignationindicatestheyearoforiginaladoptionor,inthecaseofrevision,theyearoflastrevision.Anumberinparenthesesindicatestheyearoflastreapproval.Asuperscriptepsilon(´)indicatesaneditorialchangesincethelastrevisionorreapproval.1.Scope1.1Thisspecificationcoverspuretitaniumsputteringtar-getsusedasarawmaterialinfabricatingsemiconductorelectronicdevices.1.2Thisstandardsetspuritygradelevels,physicalattri-butes,analyticalmethods,andpackaging.1.2.1Thegradedesignationisameasureoftotalmetallicimpuritycontent.Thegradedesignationdoesnotnecessarilyindicatesuitabilityforaparticularapplicationbecausefactorsotherthantotalmetallicimpuritymayinfluenceperformance.2.ReferencedDocuments2.1ASTMStandards:2E112TestMethodsforDeterminingAverageGrainSize3.Terminology3.1DefinitionsofTermsSpecifictoThisStandard:3.1.1finishedproduct,n—forthepurposesofthisstandard,a“finishedproduct”isamanufacturedsputteringtarget,readyforuse.3.1.2materiallot,n—forthepurposeofthisstandard,a“lot”ismaterialmeltedintooneingot,andprocessedasonecontinuousbatchinsubsequentthermal-mechanicaltreat-ments.4.Classification4.1GradesoftitaniumsputteringtargetsaredefinedinTable1,basedupontotalmetallicimpuritycontentoftheelementslistedinTable2.Impuritycontentsarereportedinpartspermillionbyweight(wtppm).Higherpuritygrades,forexample“5N5”and“6N”,maybeprovided,asagreeduponbetweenthepurchaserandthesupplier.4.2PuritygradeandtotalmetallicimpuritylevelsarebaseduponthesuiteofelementslistedinTable2.5.OrderingInformation5.1Ordersforpuretitaniumsputteringtargetsshallincludethefollowing:5.1.1Grade(see4.1),5.1.2Specialrequirementsconcerningimpurities,ifre-quired(see6.1,6.2,6.3,6.4),5.1.3Grainsize,ifrequired(Section7),5.1.4Configuration(Section8),5.1.5Certificationrequired(Section12),and5.1.6Whetherornotasamplerepresentati...
