ASTM_F_1709_-_97_2008.pdf

Designation:F170997(Reapproved 2008)Standard Specification forHigh Purity Titanium Sputtering Targets for Electronic ThinFilm Applications1This standard is issued under the fixed designation F1709;the number immediately following the designation indicates the year oforiginal adoption or,in the case of revision,the year of last revision.A number in parentheses indicates the year of last reapproval.Asuperscript epsilon()indicates an editorial change since the last revision or reapproval.1.Scope1.1 This specification covers pure titanium sputtering tar-gets used as a raw material in fabricating semiconductorelectronic devices.1.2 This standard sets purity grade levels,physical attri-butes,analytical methods,and packaging.1.2.1 The grade designation is a measure of total metallicimpurity content.The grade designation does not necessarilyindicate suitability for a particular application because factorsother than total metallic impurity may influence performance.2.Referenced Documents2.1 ASTM Standards:2E112 Test Methods for Determining Average Grain Size3.Terminology3.1 Definitions of Terms Specific to This Standard:3.1.1 finished product,n for the purposes of this standard,a“finished product”is a manufactured sputtering target,readyfor use.3.1.2 material lot,nfor the purpose of this standard,a“lot”is material melted into one ingot,and processed as onecontinuous batch in subsequent thermal-mechanical treat-ments.4.Classification4.1 Grades of titanium sputtering targets are defined inTable 1,based upon total metallic impurity content of theelements listed in Table 2.Impurity contents are reported inparts per million by weight(wt ppm).Higher purity grades,forexample“5N5”and“6N”,may be provided,as agreed uponbetween the purchaser and the supplier.4.2 Purity grade and total metallic impurity levels are basedupon the suite of elements listed in Table 2.5.Ordering Information5.1 Orders for pure titanium sputtering targets shall includethe following:5.1.1 Grade(see 4.1),5.1.2 Special requirements concerning impurities,if re-quired(see 6.1,6.2,6.3,6.4),5.1.3 Grain size,if required(Section 7),5.1.4 Configuration(Section 8),5.1.5 Certification required(Section 12),and5.1.6 Whether or not a sample representative of the finishedproduct is required to be provided by the supplier to thepurchaser.6.Impurities6.1 The minimum suite of metallic impurity elements to beanalyzed is defined in Table 2.Acceptable analysis methodsand detection limits are specified in Section 11.Elements notdetected will be counted and reported as present at theminimum detection limit(“mdl”).Additional elements may beanalyzed and reported as agreed upon between the purchaserand the supplier,but these shall not be counted in defining thegrade designation.6.2 Cesium,chlorine,phosphorus,and tantalum presentparticular analysis problems.The limits,analysis method,andmdl may be as agreed upon between the purchaser and thesupplier.6.3 Nonmetallic elements which shall be analyzed andreported are carbon,hydrogen,nitrogen,oxygen,and sulfur.Maximum limits for nonmetallic impurities shall be as agreedupon between the purchaser and the supplier.6.4 Acceptable limits and analytical techniques for particu-lar elements in critical applications may be agreed uponbetween the purchaser and the supplier.7.Grain Size7.1 The average and the maximum grain size shall be asagreed upon between the purchaser and the supplier.1This specification is under the jurisdiction of ASTM Committee F01 onElectronics and is the direct responsibility of Subcommittee F01.17 on SputterMetallization.Current edition approved June 15,2008.Published July 2008.Originallyapproved in 1996.Last previous edition approved in 2002 as F1709 97(2002).DOI:10.1520/F1709-97R08.2For referenced ASTM standards,visit the ASTM website,www.astm.org,orcontact ASTM Customer Service at serviceastm.org.For Annual Book of ASTMStandards volume information,refer to the standards Document Summary page onthe ASTM website.Copyright ASTM International,100 Barr Harbor Drive,PO Box C700,West Conshohocken,PA 19428-2959.United States1 7.2 Average grain size shall be measured and reported inaccordance with Test Methods E112,or other equivalentmethod.7.3 Maximum grain size shall be established by making anoptical or scanning electron micrograph of a polished andetched specimen typical of the finished product.The magnifi-cation must be calibrated to 6 10%of nominal using anappropriate gage.At least 50 grains must be resolved in themicrograph.The maximum grain size is the diagonal measureof the largest titanium crystal visible in the field of view,divided by the magnification.7.4 Average grain size and maximum grain size can alter-natively be established using computer-assisted image analysismethods.If image analysis methods are used,then the averagegrain size is defined as the mean value obtained from the graindiameter distribution data.The maximum grain size is definedas the largest grain diameter recorded in the grain sizedistribut