Designation:F542–02AnAmericanNationalStandardStandardTestMethodforExothermicTemperatureofEncapsulatingCompoundsforElectronicandMicroelectronicEncapsulation1ThisstandardisissuedunderthefixeddesignationF542;thenumberimmediatelyfollowingthedesignationindicatestheyearoforiginaladoptionor,inthecaseofrevision,theyearoflastrevision.Anumberinparenthesesindicatestheyearoflastreapproval.Asuperscriptepsilon(e)indicatesaneditorialchangesincethelastrevisionorreapproval.1.Scope1.1Thistestmethodprovidesresultsthatarerelatedtothemaximumtemperaturereachedinaspecificvolumebyareactingliquidencapsulatingcompound,andthetimefrominitialmixingtothetimewhenthispeakexothermictempera-tureisreached.1.2Thistestmethodprovidesameanstomeasurethepeakexothermictemperatureofanencapsulatingcompound.1.3Thisstandarddoesnotpurporttoaddressallofthesafetyconcerns,ifany,associatedwithitsuse.Itistheresponsibilityoftheuserofthisstandardtoestablishappro-priatesafetyandhealthpracticesanddeterminetheapplica-bilityofregulatorylimitationspriortouse.ForspecifichazardstatementsseeSection8.NOTE1—ThereisnoequivalentIECstandard.2.ReferencedDocuments2.1ASTMStandards:D1711TerminologyRelatingtoElectricalInsulation2D5423SpecificationforForced-ConvectionLaboratoryOvensforEvaluationofElectricalInsulation33.Terminology3.1Definitions:Fordefinitionsoftermsusedinthistestmethod,refertoTerminologyD1711.3.2DefinitionofTermSpecifictoThisStandard:3.2.1encapsulatingcompound,n—aresinsystemusedtoencaseelectroniccomponents.3.2.1.1Discussion—Theseresinsaregenerallyusedtopro-videprotectionfromtheoperatingenvironmentandmechani-caldamage.4.SummaryofTestMethod4.1Athermocoupleisusedtomeasurethehighesttempera-tureatthegeometriccenterofavolumeofencapsulatingcompoundinordertocharacterizetheheatgeneratedbythechemicalexothermicreaction.5.SignificanceandUse5.1Heatgeneratedbyareactingliquidencapsulatingcom-poundmaycausedamagetoheat-sensitiveelectroniccompo-nents.Degradationoftheencapsulatingcompoundmayalsooccurathightemperatures.Properselectio...
