_STP_1153-1994.pdf

STP 1153 Fatigue of Electronic Materials Scott A.Schroeder and M.R.Mitchell,editors ASTM Publication Code Number(PCN):04-011530-30 ASTM 1916 Race Street Philadelphia,PA 19103 Printed in the U.S.A.Copyright by ASTM Intl(all rights reserved);Sun Dec 27 14:38:32 EST 2015Downloaded/printed byUniversity of Washington(University of Washington)pursuant to License Agreement.No further reproductions authorized.Library of Congress Cataloging-in-Publication Data Fatigue of electronic materials/Scott A.Schroeder and M.R.Mitchell,editors.p.cm.-(ASTM special technical publication;1153)ASTM publication code number(PCN):04-011530-3 Includes bibliographical references and index.ISBN 0-8031-1994-1 1.Electronics-Materials-Fatigue.2.Electronics-Materials-Creep.Scott A.II.Mitchell,M.R.(Michael R.),1941-III.Series.TK7871.F37 1994 621.381531-dc20 I.Schroeder,94-38090 CIP Copyright?9 1994 AMERICAN SOCIETY FOR TESTING AND MATERIALS,Philadelphia,PA.All rights reserved.This material may not be reproduced or copied,in whole or in part,in any printed,mechanical,electronic,film,or other distribution and storage media,without the written consent of the publisher.Photocopy Rights Authorization to photocopy items for internal or personal use,or the internal or personal use of specific clients,is granted by the AMERICAN SOCIETY FOR TESTING AND MATERIALS for users registered with the Copyright Clearance Center(CCC)Trans-actional Reporting Service,provided that the base fee of$2.50 per copy,plus$0.50 per page is paid directly to CCC,222 Rosewood Dr.,Danvers,MA 01923;phone:(508)750-8400;fax:(508)750-4744.For those organizations that have been granted a photocopy license by CCC,a separate system of payment has been arranged.The fee code for users of the Transactional Reporting Service is 0-8031-1994-1$2.50+.50.Peer Review Policy Each paper published in this volume was evaluated by three peer reviewers.The authors addressed all of the reviewers comments to the satisfaction of both the technical editor(s)and the ASTM Committee on Publications.The quality of the papers in this publication reflects not only the obvious efforts of the authors and the technical editor(s),but also the work of these peer reviewers.The ASTM Committee on Publications acknowledges with appreciation their dedication and contribution to time and effort on behalf of ASTM.Printed in Philadelphia,PA December 1994 Copyright by ASTM Intl(all rights reserved);Sun Dec 27 14:38:32 EST 2015Downloaded/printed byUniversity of Washington(University of Washington)pursuant to License Agreement.No further reproductions authorized.Foreword This publication,Fatigue of Electronic Materials,contains papers presented at the sym-posium of the same name held in Atlanta,Georgia on 17 May 1993.The symposium was sponsored by Committee E-8 on Fatigue and Fracture.Scott A.Schroeder and M.R.Mitchell,both of Rockwell International Science Center,Thousand Oaks,Califomia,served as co-chairmen of the symposium.Copyright by ASTM Intl(all rights reserved);Sun Dec 27 14:38:32 EST 2015Downloaded/printed byUniversity of Washington(University of Washington)pursuant to License Agreement.No further reproductions authorized.Contents Overview vii Creep-Fatigue Damage Analysis of Solder Joints-S.H.Ju,S.KUSKOWSKI,B.I.SANDOR,AND M.E.PLESHA Creep-Fatigue Interactions in Eutectic Tin-Lead Solder Alloys-CHIH-WEI KUO,SHANKAR M.L.SASTRY,AND KENNETH L.JERINA 22 A Unified Creep-Plasticity Theory for Solder Alloys-DAviD L.McDoWELL,MATTHEW P.MILLER,AND DEE C.BROOKS 42 Thermomechanical and Fatigue Behavior of High-Temperature Lead and Lead-Free Solder Joints-Y.-H.PAO,S.BADGLEY,R.GOVILA,AND E.JIH 60 A Model for Primary Creep of 63Sn-37Pb Solder-S.A.SCHROEDER,W.L.MORRIS,M.R.MITCHELL,AND M.R.JAMES 82 Test Methodologies to Perform Valid Accelerated Thermomechanical Fatigue Tests of Solder JointS-DARREL R.FREAR,N.ROBERT SORENSEN,AND JOHN S.MARTENS 95 High-Cycle Fatigue of Kovar-JAMES A.WASYNCZUK,W.DAVE HANNA,FRANKLIN O.Ross,AND THOMAS A.FREITAG 110 Thermal Stresses in Cooled Heat-Releasing Elements of Electronic Devices-ANATOLIY PARNAS 123 Stress and Thermal Analysis of Resistance Temperature Detectorsm DALE A.WILSON AND ANBAZHAGAN KATHERISAN 133 Copyright by ASTM Intl(all rights reserved);Sun Dec 27 14:38:32 EST 2015Downloaded/printed byUniversity of Washington(University of Washington)pursuant to License Agreement.No further reproductions authorized.Overview The first electronic systems developed consisted of circuit components attached to printed circuit boards by mechanical methods.Component leads were either placed through holes in the circuit board,twisted together,or secured with fasteners before soldering.The solder existed only to provide additional electrical and thermal conductivity to the system.Due to the relatively secure methods of component attachment,failure or small cracks in the solder rarely caused electrical system failure.However,relatively recent advances in circuit technology and the need to increase the dens