Designation:F1512−94(Reapproved2011)StandardPracticeforUltrasonicC-ScanBondEvaluationofSputteringTarget-BackingPlateAssemblies1ThisstandardisissuedunderthefixeddesignationF1512;thenumberimmediatelyfollowingthedesignationindicatestheyearoforiginaladoptionor,inthecaseofrevision,theyearoflastrevision.Anumberinparenthesesindicatestheyearoflastreapproval.Asuperscriptepsilon(´)indicatesaneditorialchangesincethelastrevisionorreapproval.1.Scope1.1Thispracticedescribesamethodforultrasonicmappingofthesoundnessofabondjoiningasputteringtargettoitssupportingbackingplate.Theresultsoftheexaminationmaybeusedinpredictingthetarget-backingplateassembly’ssuitabilityforuse.Accept/rejectstandardsarenotspecified;thesearesubjecttoagreementbetweentargetsupplieranduser,dependingupontheapplicationrequirements.1.2ThisstandardisintendedtobeusedwithPracticeE1001.1.3Themethodrevealsunbondedareas0.125in.(3mm)indiameterandlarger.Thetechniquepermits,forexample,unambiguousquantitativemeasurementofthevoidedareainsolderbonds.1.3.1Thistechniquemayalsoshowregionsinwhichbondintegrityismarginallydegradedbyimperfectadhesion,forexample,areasinwhichoxideinclusionhasinhibitedthedevelopmentoffullbondstrength.Evaluationofindicationsofdegradedbondareasmayvaryinrigorfrompurelysubjectivetosemiquantitative.Targetsupplierandusermustagreeuponthemeansusedtodisplayandgradepartiallybondedareas.1.4Thispracticeisapplicabletoassemblieshavingplanarbondsinwhichthedesignprovidesatleastoneflatplaneparalleltothebondthatmaybeusedastheentry/exitsurfaceforultrasonicexcitation.1.5Onlytheimmersionpulse-echomethodiscovered.1.6Evaluationbythismethodisintendedtobenondestruc-tive.Fortargetassembliesthatwouldbedegradedbyimmer-sionindemineralizedwater,forexample,forporoustargetmaterials,thetestshouldbeconsideredadestructiveone.1.7Thispracticeisapplicabletobondingmethodsthatuseafillermaterialtojointhetargetandbackingplate.Theseincludesolder,epoxy,andbrazebonds.1.8Thevaluesstatedininch-poundunitsaretoberegardedasstandard.Thevaluesgiven...
