ASTM_B_832_-_93_2013.pdf

Designation:B83293(Reapproved 2013)Standard Guide forElectroforming with Nickel and Copper1This standard is issued under the fixed designation B832;the number immediately following the designation indicates the year oforiginal adoption or,in the case of revision,the year of last revision.A number in parentheses indicates the year of last reapproval.Asuperscript epsilon()indicates an editorial change since the last revision or reapproval.1.Scope1.1 This guide covers electroforming practice and describesthe processing of mandrels,the design of electroformedarticles,and the use of copper and nickel electroplatingsolutions for electroforming.1.2 This standard does not purport to address all of thesafety concerns,if any,associated with its use.It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2.Referenced Documents2.1 ASTM Standards:2B183 Practice for Preparation of Low-Carbon Steel forElectroplatingB242 Guide for Preparation of High-Carbon Steel for Elec-troplatingB252 Guide for Preparation of Zinc Alloy Die Castings forElectroplating and Conversion CoatingsB253 Guide for Preparation of Aluminum Alloys for Elec-troplatingB254 Practice for Preparation of and Electroplating onStainless SteelB281 Practice for Preparation of Copper and Copper-BaseAlloys for Electroplating and Conversion CoatingsB311 Test Method for Density of Powder Metallurgy(PM)Materials Containing Less Than Two Percent PorosityB343 Practice for Preparation of Nickel for Electroplatingwith NickelB374 Terminology Relating to ElectroplatingB489 Practice for Bend Test for Ductility of Electrodepos-ited and Autocatalytically Deposited Metal Coatings onMetalsB490 Practice for Micrometer Bend Test for Ductility ofElectrodepositsB558 Practice for Preparation of Nickel Alloys for Electro-platingB571 Practice for Qualitative Adhesion Testing of MetallicCoatingsB578 Test Method for Microhardness of Electroplated Coat-ingsB636 Test Method for Measurement of Internal Stress ofPlated Metallic Coatings with the Spiral ContractometerB659 Guide for Measuring Thickness of Metallic and Inor-ganic CoatingsB849 Specification for Pre-Treatments of Iron or Steel forReducing Risk of Hydrogen EmbrittlementE8 Test Methods for Tension Testing of Metallic MaterialsE384 Test Method for Knoop and Vickers Hardness ofMaterials3.Summary of Electroforming Practice3.1 Electroforming is defined(see Terminology B374)asthe production or reproduction of articles by electrodepositionupon a mandrel or mold that is subsequently separated from thedeposit.3.2 The basic fabrication steps are as follows:a suitablemandrel is fabricated and prepared for electroplating;themandrel is placed in an appropriate electroplating solution andmetal is deposited upon the mandrel by electrolysis;when therequired thickness of metal has been applied,the metal-covered mandrel is removed from the solution;and the mandrelis separated from the electrodeposited metal.The electroformis a separate,free-standing entity composed entirely of elec-trodeposited metal.Electroforming is concerned with thefabrication of articles of various kinds.4.Significance and Use4.1 The specialized use of the electroplating process forelectroforming results in the manufacture of tools and productsthat are unique and often impossible to make economically bytraditional methods of fabrication.Current applications ofnickel electroforming include:textile printing screens;compo-nents of rocket thrust chambers,nozzles,and motor cases;molds and dies for making automotive arm-rests and instru-ment panels;stampers for making phonograph records,video-discs,and audio compact discs;mesh products for making1This guide is under the jurisdiction of ASTM Committee B08 on Metallic andInorganic Coatings and is the direct responsibility of Subcommittee B08.03 onEngineering Coatings.Current edition approved Dec.1,2013.Published December 2013.Originallyapproved in 1993.Last previous edition approved in 2008 as B832 93(2008).DOI:10.1520/B0832-93R13.2For referenced ASTM standards,visit the ASTM website,www.astm.org,orcontact ASTM Customer Service at serviceastm.org.For Annual Book of ASTMStandards volume information,refer to the standards Document Summary page onthe ASTM website.Copyright ASTM International,100 Barr Harbor Drive,PO Box C700,West Conshohocken,PA 19428-2959.United States1 porous battery electrodes,filters,and razor screens;and opticalparts,bellows,and radar wave guides(1-3).34.2 Copper is extensively used for electroforming thin foilfor the printed circuit industry.Copper foil is formed continu-ously by electrodeposition onto rotating drums.Copper is oftenused as a backing material for electroformed nickel shells andin other applications where its high thermal and electricalconductivities are required.Other metals including gold areelectroformed on a smaller scale.4.3 Electroforming is used whenever the difficulty