ASTM_D_3380_-_14.pdf

Designation:D338014Standard Test Method forRelative Permittivity(Dielectric Constant)and DissipationFactor of Polymer-Based Microwave Circuit Substrates1This standard is issued under the fixed designation D3380;the number immediately following the designation indicates the year oforiginal adoption or,in the case of revision,the year of last revision.A number in parentheses indicates the year of last reapproval.Asuperscript epsilon()indicates an editorial change since the last revision or reapproval.1.Scope*1.1 This test method permits the rapid measurement ofapparent relative permittivity and loss tangent(dissipationfactor)of metal-clad polymer-based circuit substrates in theX-band(8 to 12.4 GHz).1.2 This test method is suitable for testing PTFE(polytet-rafluorethylene)impregnated glass cloth or random-orientedfibermats,glassfiber-reinforcedpolystyrene,polyphenyleneoxide,irradiated polyethylene,and similar ma-terials having a nominal specimen thickness of116in.(1.6 mm).The materials listed in the preceding sentence havebeen used in commercial applications at nominal frequency of9.6 GHz.NOTE1See Appendix X1 for additional information about range ofpermittivity,thickness other than 1.6 mm,and tests at frequencies otherthan 9.6 GHz.1.3 The values stated in inch-pound units are to be regardedas standard.The values given in parentheses are mathematicalconversions to SI units that are provided for information onlyand are not considered standard.1.4 This standard does not purport to address all of thesafety concerns,if any,associated with its use.It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2.Referenced Documents2.1 ASTM Standards:2D150 Test Methods for AC Loss Characteristics and Permit-tivity(Dielectric Constant)of Solid Electrical InsulationD1711 Terminology Relating to Electrical InsulationD2520 Test Methods for Complex Permittivity(DielectricConstant)of Solid Electrical Insulating Materials at Mi-crowave Frequencies and Temperatures to 1650CD6054 Practice for Conditioning Electrical Insulating Mate-rials for Testing(Withdrawn 2012)32.2 IPC Standards:4IPC-TM-650 Test Methods Manual Method 2.5.5.5.IPC-MF-4562 Metal Foil for Printed Wiring Applications.2.3 IEEE Standards:5Standard No.488.1 Standard Digital Interface for Program-mable Instrumentation.Standard No.488.2 Standards,Codes,Formats,Protocolsand Common Commands for Use with ANSI and IEEEStandard 488.1.3.Terminology3.1 DefinitionsSee Terminology D1711 for the definitionsof terms used in this test method.See also Test MethodsD2520,D150,and IPC TM-650 for additional informationregarding the terminology.3.2 Definitions of Terms Specific to This Standard:3.2.1 Da symbol used in this test method for the dissipa-tion factor.3.2.2 La correction factor associated with length whichcorrects for the fringing capacitance at the ends of the resonatorelement.3.2.3 symbol used in this test method to denote relativepermittivity.3.2.3.1 DiscussionThe preferred symbol for permittivityis Greek kappa prime,but some persons use other symbols todenote this property such as DK,SIC,or R.3.2.4 microstrip line,na microwave transmission lineemploying a flat strip conductor bonded to one surface of adielectric board or sheet,the other surface of which is cladwith,or bonded to,a continuous conductive foil or plate whichis substantially wider than the strip.1This test method is under the jurisdiction of ASTM Committee D09 onElectrical and Electronic Insulating Materials and is the direct responsibility ofSubcommittee D09.12 on Electrical Tests.Current edition approved Nov.1,2014.Published November 2014.Originallyapproved in 1975.Last previous edition approved in 2010 as D3380 10.DOI:10.1520/D3380-14.2For referenced ASTM standards,visit the ASTM website,www.astm.org,orcontact ASTM Customer Service at serviceastm.org.For Annual Book of ASTMStandards volume information,refer to the standards Document Summary page onthe ASTM website.3The last approved version of this historical standard is referenced onwww.astm.org.4Available from IPC,3000 Lakeside Drive,Suite 309S,Bannockburn,IL 60015.5Available from Institute of Electrical and Electronics Engineers,Inc.(IEEE),445 Hoes Ln.,P.O.Box 1331,Piscataway,NJ 08854-1331,http:/www.ieee.org.*A Summary of Changes section appears at the end of this standardCopyright ASTM International,100 Barr Harbor Drive,PO Box C700,West Conshohocken,PA 19428-2959.United States1 3.2.4.1 DiscussionMicrostrip provides easier accessibilitythan stripline for attaching components and devices to the stripcircuitry.3.2.5 microwave substrate,na board or sheet of low-lossdielectric material that is clad with metal foil either on one orboth surfaces,from which all metal is removed by etching priorto testing.3.2.6 stripline,nmicrowave transmission line using a flatstrip conductor clamped,or bonded,between two substantiallywider dielectric boards