ASTM_D_5109_-_12.pdf

Designation:D510912Standard Test Methods forCopper-Clad Thermosetting Laminates for Printed WiringBoards1This standard is issued under the fixed designation D5109;the number immediately following the designation indicates the year oforiginal adoption or,in the case of revision,the year of last revision.A number in parentheses indicates the year of last reapproval.Asuperscript epsilon()indicates an editorial change since the last revision or reapproval.1.Scope*1.1 These test methods cover the procedures for testingcopper-clad laminates produced from fiber-reinforced,thermo-setting polymeric materials intended for fabrication of printedwiring boards.1.2 The procedures appear in the following sections:ProcedureSectionReferenced Documents2Conditioning4Dielectric Breakdown Voltage Parallel to Laminations13Dimensional Instability19Dissipation Factor14Flammability Rating Test16Flexural Strength,Flatwise at Elevated Temperature15Flexural Strength,Flatwise at Room Temperature15Oven Blister Test17Peel Strength Test at Elevated Temperature10Peel Strength Test at Room Temperature9Permittivity14Pin Holes in Copper Surface20Purity of Copper5Scratches in Copper Surface21Solder Float Test8Solvent Resistance7Surface Resistivity11Volume Resistivity11Terminology3Thickness&Thickness Variation18Warp or Twist6Water Absorption121.3 Metric units are the preferred units for these testmethods.Inch-pound units,where shown,are presented forinformation only.1.4 This standard does not purport to address all of thesafety concerns,if any,associated with its use.It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.For specific hazardstatements,see 7.2.1,8.1,and 11.3.1.2.Referenced Documents2.1 ASTM Standards:2D150 Test Methods for AC Loss Characteristics and Permit-tivity(Dielectric Constant)of Solid Electrical InsulationD229 Test Methods for Rigid Sheet and Plate MaterialsUsed for Electrical InsulationD257 Test Methods for DC Resistance or Conductance ofInsulating MaterialsD374 Test Methods for Thickness of Solid Electrical Insu-lation(Withdrawn 2013)3D618 Practice for Conditioning Plastics for TestingD1531 Test Methods for Relative Permittivity(DielectricConstant)and Dissipation Factor by Fluid DisplacementProcedures(Withdrawn 2012)3D1711 Terminology Relating to Electrical InsulationD1825 Practice for Etching and Cleaning Copper-Clad Elec-trical Insulating Materials and Thermosetting Laminatesfor Electrical Testing(Withdrawn 2012)3D1867 Specification for Copper-Clad Thermosetting Lami-nates for Printed WiringD3636 Practice for Sampling and Judging Quality of SolidElectrical Insulating MaterialsE53 Test Method for Determination of Copper in UnalloyedCopper by Gravimetry2.2 Other Standard:NEMA Publication Number LI 1-1975 Test for Hot PeelStrength of Copper-Clad Industrial Laminates for PrintedCircuits43.Terminology3.1 Definitions:Definitions of terms used in these testmethods are found in Terminology D1711.3.2 Definitions of Terms Specific to This Standard:1These test methods are under the jurisdiction of ASTM Committee D09 onElectrical and Electronic Insulating Materials and are the direct responsibility ofSubcommittee D09.07 on Flexible and Rigid Insulating Materials.Current edition approved Nov.1,2012.Published November 2012.Originallyapproved in 1990.Last previous edition approved in 2004 as D5109 99(2004).DOI:10.1520/D5109-12.2For referenced ASTM standards,visit the ASTM website,www.astm.org,orcontact ASTM Customer Service at serviceastm.org.For Annual Book of ASTMStandards volume information,refer to the standards Document Summary page onthe ASTM website.3The last approved version of this historical standard is referenced onwww.astm.org.4Available from National Electronic ManufacturersAssociation(NEMA),2101L St.,NW,Washington,DC 20037.*A Summary of Changes section appears at the end of this standardCopyright ASTM International,100 Barr Harbor Drive,PO Box C700,West Conshohocken,PA 19428-2959.United States1 3.2.1 blister,copper,na gas pocket(a void)located at theinterface of the dielectric and the copper foil in a copper-cladlaminate.3.2.2 blister,core,na gas pocket(a void)located betweenthe laminations in the dielectric core of a copper-clad laminate.3.2.3 dimensional instabilitya characteristic of a solidmaterial that is displayed by changes in the dimensions of a testspecimen when the specimen is subjected to environmentssimilar to those that the material may encounter during themanufacturing operations or use.3.2.4 peel strength,na force required to separate copperfoil from the surface of a copper-clad laminate using a specifictest method.It is reported as a force per unit width.3.2.5 trace,nin the printed wiring board industry,anelectrically conducting element of a printed circuit board thatremains on the laminate surface after etching.4.Conditioning4.1 Unless otherwise stated in these test methods,condit